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NEWS TAGGED CHIPBOND
Tuesday 24 July 2018
Orders for OLED driver ICs to boost Chipbond revenues in 2019-2020
Taiwan-based backend firm Chipbond Technology is expected to see revenues generated from orders for OLED panel driver ICs make a substantial contribution to company revenues in 2019...
Friday 29 June 2018
Backend firms gearing up for robust demand for TDDI chips
Demand for TDDI (touch and display driver integration) chips is set to ramp up starting the third quarter, with Taiwan-based backend firms including Chipbond Technology and ChipMOS...
Tuesday 26 June 2018
COF packaging substrate, service suppliers bracing for strong sales in 2H18
Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...
Wednesday 20 June 2018
Chipbond thinks COF crucial for packaging smartphone driver ICs
The most important evolution in the LCD driver IC packaging sector in 2018 is that the COF (chip on film) package process has become a crucial alternative to COG (chip on glass) for...
Tuesday 20 March 2018
COF demand to receive boost in 2H18, says JMC
Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
Thursday 1 March 2018
Chipbond net profits climb to 3-year high
LCD driver IC backend specialist Chipbond Technology saw its net profits increase 13.1% to a three-year high of NT$2.25 billion (US$76.9 million) in 2017. EPS for the year reached...
Thursday 18 January 2018
Taiwan makers to benefit from China OLED capacity build-ups
The massive build-ups of OLED panel production capacity by China-based panel makers are expected to bring business opportunities for Taiwan-based makers, including driver IC designers,...
Monday 8 January 2018
Taiwan IC backend service firms to face increasing competition from China in 2018
While expecting to benefit from increasing demand for IC solutions from the IoT, AI and 5G sectors in 2018, Taiwan-based IC testing and packaging service providers are also expected...
Thursday 21 December 2017
COF packaging in growing demand
With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging...
Tuesday 19 December 2017
Taiwan backend firms eyeing OLED driver IC opportunities
With China's LCD panel industry emerging as a major supply source worldwide and demand for panels among China brand vendors of ICT products expanding significantly, Taiwan-based LCD...
Monday 18 December 2017
Chipbond seeking to cement China market share, says chairman
Taiwan-based LCD driver IC packaging and testing service provider Chipbond Technology's latest strategic investment deployments in China are mainly designed to consolidate its market...
Friday 15 December 2017
Chipbond to sell stake in China-based subsidiary
LCD driver IC packaging and testing service provider Chipbond Technology will sell a 53.69% stake in Chipmore Technology, its subsidiary based in Suzhou, to a group of investors consisting...
Thursday 2 November 2017
Chipbond posts profit growth in 3Q17
LCD driver IC backend specialist Chipbond Technology saw its net profits increase 37.7% sequentially to NT$702 million (US$23.3 million) in the third quarter. Net profits for the...
Friday 13 October 2017
Chipbond posts record 3Q17 revenues
Chipbond Technology's consolidated revenues climbed to a record high of about NT$5 billion (US$165.3 million) in the third quarter of 2017. Market watchers expect the company to post...
Monday 25 September 2017
Taiwan IC backend firms to enjoy strong 4Q17
A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...