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Friday 13 June 2025
Micron reportedly clinches SOCAMM lead with Nvidia's greenlight
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...
Friday 13 June 2025
AMD to showcase MI350 AI accelerators on TSMC 3nm process at 'Advancing AI 2025' event
AMD will host its "Advancing AI 2025" event on June 13 (Taipei time) in San Jose, California, where CEO Lisa Su and senior executives will unveil the company's latest AI roadmap....
Thursday 12 June 2025
Nvidia to build 20 AI factories in Europe, bets on quantum computing and sovereign AI
Nvidia CEO Jensen Huang announced an ambitious plan to multiply Europe's AI computing capacity tenfold over the next two years by constructing 20 new "AI factories" in partnership...
Thursday 12 June 2025
Samsung reportedly fails third Nvidia HBM3E test; eyes re-certification in September
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
Thursday 12 June 2025
Chips losing bargaining power? Rare earth emerges as strategic leverage in US-China trade talks
In mid-June, high-level China-US economic and trade talks held in London concluded with both sides reaching a preliminary agreement on a trade framework, according to Chinese Vice...
Thursday 12 June 2025
Honda plans investment in Rapidus to support Japan's 2nm chip ambitions
Honda Motor is preparing to invest in Japanese semiconductor startup Rapidus during the second half of fiscal year 2025 (October 2025 to March 2026), with a commitment expected to...
Thursday 12 June 2025
Taiwan unveils breakthrough in 8-inch quantum chip fabrication
Academia Sinica announced on June 10, 2025, the successful development of several advanced fabrication processes for superconducting qubits on an automated 8-inch platform, positioning...
Wednesday 11 June 2025
DDR4 crunch sends prices soaring 50%
Memory manufacturers are reducing production capacity for older processes, driving DDR4 prices to skyrocket. Although Samsung Electronics' last buy order (LBO) for DDR4 was originally...
Wednesday 11 June 2025
Japan's chip comeback gains ground, but industry group warns of gaps beyond logic ICs
Japan has made meaningful strides in reclaiming its semiconductor competitiveness with the establishment of the Leading-edge Semiconductor Technology Center (LSTC) and Rapidus, aiming...
Wednesday 11 June 2025
Qualcomm demonstrates new processor for AI-based smart glasses
Qualcomm Inc., the top maker of smartphone processors, is making a bigger push into smart glasses with low-power components that can run artificial intelligence software.
Tuesday 10 June 2025
Struggling to enhance chip test performance? Let's explore solutions!
In the age of digital residents, semiconductor chips are present in almost every aspect of our lives. Whether it is from data centers to computers, cell phones, computer central processing...
Tuesday 10 June 2025
YMTC sues Micron over 'spyware' allegations amid ongoing patent, IP battles
Chinese memory chipmaker Yangtze Memory Technologies Co. (YMTC) has filed a federal lawsuit in Washington, DC, accusing US-based Micron Technology of launching a disinformation campaign...
Tuesday 10 June 2025
Qualcomm seals Autotalks deal, expands V2X chip output with Samsung Foundry
Qualcomm CDMA Technologies (QCT), a unit of Qualcomm Inc., has finalized its acquisition of Israeli vehicle-to-everything (V2X) chipmaker Autotalks, reinforcing its push into connected...
Tuesday 10 June 2025
Tariffs, currency swings, and inventory risks weigh on Taiwan's IC sector outlook
After a front-loaded surge in shipments driven by tariff fears and early stockpiling, Taiwan's IC distributors are facing a much more uncertain second half of 2025. A cocktail of...
Tuesday 10 June 2025
Samsung likely to rely on HBM4 as UBS reports delay in 12-layer HBM3E certification
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...