Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
Vasily Shpak, Deputy Minister of Industry and Trade of the Russian Federation, was quoted by Ijiwei, a Chinese media focusing on semiconductor news that Russia will soon...
China has set up the country's largest-ever semiconductor investment fund to propel the development of the domestic chip industry, the latest effort from Beijing to achieve self-sufficiency...
The US is proposing to make Kenya the first country in Africa to benefit from funding in the Chips and Science Act, according to White House officials, underscoring the countries'...
Absolics, an affiliate of South Korean chemical material firm SKC and invested by Applied Materials, signed a Preliminary Memorandum of Terms (PMT) with the US Department of Commerce...
In 2024, the consumer electronics market is gradually recovering. However, there are mixed signals in the end-user application market, with some reports suggesting bleak prospects...
The PC sector, which had been relatively quiet for some time, has regained global attention due to two key developments: Artificial Intelligence (AI) and Microsoft's backing for the...
Even though Taiwan-based IC design firms expect Wi-Fi 7 penetration rates to remain in the single digits in 2024, multiple sources in the semiconductor supply chain note that manufacturers...
There have been reports that Samsung Electronics' 3nm manufacturing process is ready and will be used on its newest Exynos flagship processor platform, which is expected to be released...
