Qualcomm reported slightly stronger-than-expected results over the past quarter, and its upbeat outlook suggests an improvement in the mobile phone industry. Qualcomm also expects...
Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless...
Huawei continues its relentless journey towards chip self-sufficiency, showcasing signs of China's further advancements in advanced manufacturing processes.
The US Department of Commerce and Micron Technology have signed a non-binding Preliminary Memorandum of Terms (PMT) to provide up to US$6.14 billion in direct funding under the CHIPS...
Intel has formed alliances with second-tier foundries including UMC and Tower Semiconductor to reduce costs and optimize production utilization, among other reasons, which may enhance...
American memory chip giant Micron Technology, which has not built a new fab in the US for 20 years, is expected to step up its construction of new manufacturing facilities in New...
In the dynamic realm of AI, TSMC has secured the vast majority of customer orders, and foundry quotes now surpassing US$10,000 per wafer are primarily centered on the lucrative process...
Upon TSMC Arizona's signing of a Preliminary Memorandum of Terms (PMT) with the Biden Administration, the decision to manufacture 2nm chips in its third fab and part of the second...
Micron Technology Inc., the largest US maker of computer-memory chips, is poised to get $6.1 billion in grants from the Commerce Department to help pay for domestic factory projects,...
Microsoft's substantial investment of US$1.5 billion has secured it a board seat in the United Arab Emirates-based AI firm G42, albeit with a trade-off.
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
