Below are the most-read DIGITIMES Asia stories from the week of May 11-17, 2026:
AMD's 2nm defection to Samsung dents TSMC's AI grip
TSMC's dominance in AI chip manufacturing is facing early pressure as AMD, Tesla, Google, Nvidia, and others explore Samsung and Intel as backup suppliers. Driven by soaring AI demand, rising foundry costs, and geopolitical risks, customers are prioritizing supply-chain resilience. Still, Samsung and Intel continue struggling with yields and stability, limiting any near-term challenge to TSMC.
Interview: Cyient Semiconductors CEO on Kinetic acquisition — why power is the new compute bottleneck
Cyient Semiconductors is shifting from a pure ASIC services company toward a hybrid semiconductor product model focused on intelligent power solutions for AI infrastructure. Its acquisition of Kinetic Technologies strengthens capabilities in power management, DC-to-DC conversion, and ASSPs, targeting AI data centers, edge computing, and industrial systems. The company also sees Taiwan as a key ecosystem partner for manufacturing, IP, and future acquisitions.
Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
South Korea's Hanwha Semitech is preparing to supply FO-PLP advanced packaging equipment for mass production in late 2026, with the systems reportedly tied to networking chips for SpaceX. The move expands Hanwha's business beyond HBM TC bonders into advanced back-end packaging, an increasingly critical area for AI and satellite semiconductors. FO-PLP technology improves chip integration density while lowering production costs through panel-based manufacturing.
Apple, Qualcomm, and MediaTek take different paths as TSMC capacity stays tight
Rising AI and HPC demand is tightening advanced chip supply at TSMC, pushing some customers to selectively diversify manufacturing. Apple, Qualcomm, and others are exploring Intel or Samsung Electronics for lower-end or less critical chips, while keeping flagship products on TSMC's leading-edge nodes. Despite limited diversification, advanced AI and networking chips remain heavily dependent on TSMC's constrained capacity.
Intel's revival secret: Suppliers with TSMC's stamp of approval
Intel is mounting a broader comeback under CEO Lip-Bu Tan, fueled by US manufacturing expansion, recruitment of former TSMC talent, and deeper ties with Taiwanese suppliers. As AI demand strains TSMC capacity, Intel is emerging as a meaningful alternative in foundry and advanced packaging, creating new "non-TSMC" business opportunities for Taiwan's semiconductor supply chain while reducing industry dependence on a single manufacturer.
For India's chip dream, Lam Research points beyond fabs
Lam Research sees India's semiconductor opportunity beyond fabs, focusing on building precision suppliers, engineering talent, and ecosystem readiness. It is expanding virtual training via Semiverse and university partnerships to address skills gaps. While fabs remain limited, India could integrate into global supply chains by supporting semiconductor equipment and manufacturing infrastructure development.
Analysis: Intel's Apple deal boosts CEO Tan's turnaround, but hard part still lies ahead
Intel's reported preliminary deal to make chips for Apple would be a major validation of CEO Lip-Bu Tan's foundry turnaround strategy and a symbolic win for Intel Foundry. It could boost credibility and attract customers, but deep issues remain, including weak yields, higher costs versus TSMC, and execution challenges in scaling competitive manufacturing.
Article edited by Jack Wu
