GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...
AMD CEO Lisa Su arrived in Taiwan on October 5 for a lightning visit, less than five months after her May trip. No major public events are scheduled, but meetings with key suppliers...
As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...
TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...
TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
