CONNECT WITH US
NEWS TAGGED COWOS
Thursday 27 November 2025
Fusion Worldwide: The Three Resources That Actually Gate AI Progress Right Now

From TSMC to SK hynix, every Q3 2025 earnings call delivered the same sobering message, the AI build-out is being throttled by three physical choke points that no amount...

Wednesday 26 November 2025
Global data center AI chip packaging market forecast, 2024-2030
Technological Backbone and Future Platforms
Monday 24 November 2025
TSMC ramps 3/2nm and CoWoS capacity amid 24-hour production push
Despite Nvidia's strong third quarter of fiscal 2026 performance, surpassing forecasts for 12 consecutive quarters, global market concerns over AI remain. According to supply chain...
Monday 24 November 2025
Intel's EMIB becomes potential alternative to TSMC's CoWoS
TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
Thursday 20 November 2025
ASML expands into advanced CoWoS packaging with new I-line system
Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
Monday 17 November 2025
TSMC accelerates CoPoS mass production to 2029, Taiwan suppliers win first orders
The market is focusing on rising demand for Nvidia AI GPUs and various ASICs, with optimism growing as TSMC plans to expand its CoWoS capacity and sees OSAT partners joining the race...
Sunday 16 November 2025
Taiwan supply chain chases AI growth after missing initial wave
Benefiting from the artificial intelligence (AI) boom driving strong semiconductor and server exports, Taiwan's economic growth forecast for 2025 has been revised up to 5.94% by the...
Wednesday 22 October 2025
TSMC strengthens foundry 2.0 leadership, backed by robust AI chip packaging demand
AI investment has boosted semiconductor demand, with TSMC reporting a third-quarter 2025 revenue of US$33.1 billion. Strong advanced packaging demand, supported by Nvidia GPUs, benefits...
Thursday 9 October 2025
Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP
SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...
Friday 3 October 2025
ASE Technology launches new factory in Kaohsiung to expand advanced semiconductor packaging
ASE Technology Holding has initiated construction of a new K18B factory at the Nanzi Science Park in Kaohsiung to address growing demand in artificial intelligence (AI), automotive...
Thursday 2 October 2025
CoWoS creates turning point for 12-inch SiC
Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
Tuesday 30 September 2025
Non-China supply chain pushes 12-inch SiC into advanced packaging, but China stands to gain
The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is...
Tuesday 23 September 2025
Nvidia-Intel alliance to boost long-term demand for ABF substrates
Nvidia and Intel have announced a rare partnership to jointly develop next-generation AI data center and PC platform chips. Despite predominantly negative market interpretations,...
Tuesday 23 September 2025
TSMC extends lead in foundry market as Samsung loses ground
The global boom in artificial intelligence is creating a stark divide in the semiconductor industry, with Taiwan's TSMC solidifying its dominance while rival Samsung Electronics falls...
Tuesday 23 September 2025
12-inch SiC substrates poised for two-phase entry onto CoWoS packaging
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...