The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...

Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...

The supply chain for Nvidia's AI processors continues to evolve and expand, despite recent negative market sentiment, according to industry sources.

A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...

SEMICON Taiwan 2024 has just concluded, and industry observers have noted one key difference compared to previous years: the number of equipment manufacturers participating, which...

Wah Lee Industrial, which distributes photoresist and CMP slurries, and other front-end process manufacturing materials, expects robust demand for CoWoS packaging to drive significant...

As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...

SEMICON Taiwan 2024 is set to take place from September 4 to 6 and will feature over 20 forums.

Major players in Nvidia's supply chain, such as global foundry leader TSMC, have good order visibility extending to 2026, despite stock investors' concern about the US chip vendor's...

Electronic component distributor Macnica Anstek reported steady orders for automated testing in the second half of 2024, benefiting from strong CoWoS demand. The company expects its...

Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...

Nvidia will release its fiscal second-quarter financial results on August 28. The market has high expectations for the company, anticipating revenue and gross margin figures to exceed...

The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...

Taiwanese IC design company Egis Technology (EgisTec) is actively exploring innovative opportunities in the cloud AI market through a collaboration with Arm.

As the application scope of genAI grows so does the market for its chips, with forecasts predicting explosive growth in the coming years.