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Wednesday 4 June 2025
CoWoS material shortage triggers AI supply chain concerns; TSMC and ASE expected to receive priority access
As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
Monday 2 June 2025
AIchip goes all in on CoWoS advanced packaging
Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
Tuesday 27 May 2025
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing...
Tuesday 27 May 2025
AI chips and CoWoS orders keep HPI’s outlook running hot
Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...
Monday 26 May 2025
TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM
Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...
Monday 26 May 2025
As Nvidia deepens roots in Taipei, Taiwan launches push to attract global talent

Nvidia CEO Jensen Huang delivered a powerful message at the company's GTC global press conference in Taipei this week: the key to Nvidia's...

Thursday 22 May 2025
Nvidia's Taiwan inner circle powers up for the Blackwell era
During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
Monday 19 May 2025
The beauty and sorrow of a one-man stage: TSMC's advanced process technology and packaging
From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April,...
Monday 19 May 2025
ART confirms normal operations after hacker attack, no confidential data compromised
Semiconductor equipment manufacturer All-Ring Tech (ART) recently reported a significant cybersecurity incident involving the leakage of internal data by external hackers. ART stated...
Tuesday 6 May 2025
Tariff tensions delay ABF substrate recovery as Unimicron shifts focus to CoWoS clients
Uncertainty surrounding US President Donald Trump's tariff policy has rattled global supply chains and triggered downward revisions in growth forecasts for consumer electronics and...
Wednesday 30 April 2025
TSMC's AI chip plans remain on track; CoWoS capacity to double in 2025
TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary to recent market speculation about order reductions from...
Monday 28 April 2025
FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

Thursday 24 April 2025
What TSMC revealed at 2025 Symposium
At its 2025 North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that complements its 1.8nm (18A) process. From advanced...
Friday 18 April 2025
C Sun poised to join US semiconductor expansion wave
C Sun Manufacturing is showcasing its advanced semiconductor, PCB, and panel-level packaging (PLP) equipment at Touch Taiwan 2025, emphasizing continued growth despite mounting concerns...
Monday 7 April 2025
PVI expands production capacity, expects 40% revenue growth in 2025
As a leader in advanced processes and the CoWoS and SoIC advanced packaging supply chain, Praise Victor Industrial (PVI) is benefited from the ongoing semiconductor expansion wave,...