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Wednesday 30 October 2024
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
Wednesday 30 October 2024
Hon Precision secures orders from top US CSPs, riding the CoWoS growth wave
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
Tuesday 29 October 2024
TSMC's go-to partner for AI demand: ASE's SPIL invests US$13 million to boost CoWoS capacity
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Tuesday 29 October 2024
TSMC intends to expand AP8 by acquiring nearby facilities from Innolux, say sources
TSMC, which acquired Innolux's 5.5G LCD fab in Tainan (southern Taiwan) in August, intends to acquire additional Innolux facilities that are adjacent to the one it has already acquired,...
Tuesday 22 October 2024
Manz pushing CoPoS to drive up AI chip capacity
Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...
Wednesday 16 October 2024
TSMC raises CoWoS output goal again, say sources
TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging,...
Tuesday 15 October 2024
OSATs budget more capex in 2024 than 2023
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Friday 11 October 2024
TSMC accelerates Fab AP8 project for CoWoS advanced packaging
TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...
Monday 7 October 2024
TSMC's three-pronged strategy: Outsourcing CoWoS to Amkor as US plant exceeds expectations
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...
Thursday 3 October 2024
TSMC's backend equipment suppliers benefit from AI chip demand
Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers...
Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Tuesday 24 September 2024
TSMC SoIC fab capacity to reportedly boost through to 2026
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
Friday 20 September 2024
TSMC demand boosts suppliers performance; smaller ones gain competitiveness
Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...
Friday 13 September 2024
Nvidia AI chip supply chain grows amid market skepticism
The supply chain for Nvidia's AI processors continues to evolve and expand, despite recent negative market sentiment, according to industry sources.
Tuesday 10 September 2024
Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research