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    Energy limitation narrows robot applications range despite advances in vision language models
    Jun 5, 18:59
    Huawei's upcoming Pura 80 launch signals major play for premium dominance
    Jun 5, 18:59
    Commentary: China's vicious price war cause carmakers profit slump below bubble tea shops
    Jun 5, 18:54
    Commentary: Trump shifts investment squeeze on Samsung following TSMC
    Jun 5, 18:54
    Rivals turn partners: What's the deal behind Xpeng and Huawei collaboration on AR-HUD?
    Jun 5, 18:54
    Acer's Asia-Pacific operations face challenges, spur conservative market attitude
    Jun 5, 18:54
    Exclusive: GaN-on-SiC powers US-China stealth aircraft radar race
    Jun 5, 18:54
    NEWS TAGGED COWOS
    Wednesday 4 June 2025
    CoWoS material shortage triggers AI supply chain concerns; TSMC and ASE expected to receive priority access
    As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
    Monday 2 June 2025
    AIchip goes all in on CoWoS advanced packaging
    Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
    Tuesday 27 May 2025
    TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
    Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing...
    Tuesday 27 May 2025
    AI chips and CoWoS orders keep HPI’s outlook running hot
    Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...
    Monday 26 May 2025
    TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM
    Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...
    Monday 26 May 2025
    As Nvidia deepens roots in Taipei, Taiwan launches push to attract global talent

    Nvidia CEO Jensen Huang delivered a powerful message at the company's GTC global press conference in Taipei this week: the key to Nvidia's...

    Thursday 22 May 2025
    Nvidia's Taiwan inner circle powers up for the Blackwell era
    During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
    Monday 19 May 2025
    The beauty and sorrow of a one-man stage: TSMC's advanced process technology and packaging
    From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April,...
    Monday 19 May 2025
    ART confirms normal operations after hacker attack, no confidential data compromised
    Semiconductor equipment manufacturer All-Ring Tech (ART) recently reported a significant cybersecurity incident involving the leakage of internal data by external hackers. ART stated...
    Tuesday 6 May 2025
    Tariff tensions delay ABF substrate recovery as Unimicron shifts focus to CoWoS clients
    Uncertainty surrounding US President Donald Trump's tariff policy has rattled global supply chains and triggered downward revisions in growth forecasts for consumer electronics and...
    Wednesday 30 April 2025
    TSMC's AI chip plans remain on track; CoWoS capacity to double in 2025
    TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary to recent market speculation about order reductions from...
    Monday 28 April 2025
    FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

    As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

    Thursday 24 April 2025
    What TSMC revealed at 2025 Symposium
    At its 2025 North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that complements its 1.8nm (18A) process. From advanced...
    Friday 18 April 2025
    C Sun poised to join US semiconductor expansion wave
    C Sun Manufacturing is showcasing its advanced semiconductor, PCB, and panel-level packaging (PLP) equipment at Touch Taiwan 2025, emphasizing continued growth despite mounting concerns...
    Monday 7 April 2025
    PVI expands production capacity, expects 40% revenue growth in 2025
    As a leader in advanced processes and the CoWoS and SoIC advanced packaging supply chain, Praise Victor Industrial (PVI) is benefited from the ongoing semiconductor expansion wave,...
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    Research Report Database
    BIZ FOCUS
    Jun 5, 14:54
    BIOSTAR concludes COMPUTEX 2025 on a high note with the debut of Edge-Comp series and edge AI platforms
    Thursday 5 June 2025
    Darveen signs distributor agreement with IP SYSTEMES to expand market presence in France
    Wednesday 4 June 2025
    "Revenge Seekers" team develops AI-powered emergency assistant to improve disaster response efficiency.
    Wednesday 4 June 2025
    Bidirectional engagement meets fans' emotional needs: "Disheveled in the Wind" presents Aidol
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES