ASE Technology Holding has initiated construction of a new K18B factory at the Nanzi Science Park in Kaohsiung to address growing demand in artificial intelligence (AI), automotive...
Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is...
Nvidia and Intel have announced a rare partnership to jointly develop next-generation AI data center and PC platform chips. Despite predominantly negative market interpretations,...
The global boom in artificial intelligence is creating a stark divide in the semiconductor industry, with Taiwan's TSMC solidifying its dominance while rival Samsung Electronics falls...
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Taiwan's AI server exports have doubled, with manufacturers' GPU and graphics card production capacity fully booked, driving remarkable export growth for the country. Minister of...
The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process...
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs)...
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
