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    NEWS TAGGED COWOS
    Friday 22 May 2026
    AMD's Lisa Su says memory is becoming another pressure point for AI chips

    AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure...

    Friday 22 May 2026
    AMD backs Taiwan EFB packaging chain to cut CoWoS reliance

    AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while...

    Monday 18 May 2026
    TSMC CoWoS yields top 98% as capacity expands
    Following its North America technology forum, TSMC held the Hsinchu session on May 14, 2026. The company said the smart revolution is beginning, with AI evolving from generative AI...
    Friday 15 May 2026
    Commentary: The Thucydides trap and TSMC's COUPE
    On May 14, Xi Jinping opened his summit with Donald Trump in Beijing by invoking the Thucydides Trap — the idea that a rising power and an established hegemon are structurally...
    Friday 15 May 2026
    TSMC's Vanguard stake sale signals AI-era capital pivot
    TSMC's decision to sell down its stake in Vanguard International Semiconductor (VIS) is the second significant portfolio move the company has made in as many weeks — and together,...
    Thursday 14 May 2026
    TSMC expands CoWoS and SoIC capacity on AI boom
    TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities...
    Thursday 14 May 2026
    MediaTek courts Intel as Google pushes for alternatives to CoWoS
    MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely...
    Tuesday 12 May 2026
    TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push
    TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI acceler...
    Friday 8 May 2026
    TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
    TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to...
    Wednesday 6 May 2026
    VIS joins CoWoS chain with TSMC-backed Singapore interposer foundry
    Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push...
    Tuesday 5 May 2026
    Analysis: CoWoS crunch and MediaTek's hire raise a bigger question — can Intel deliver?
    The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...
    Friday 24 April 2026
    TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker
    The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
    Thursday 23 April 2026
    TSMC targets 2029 production for A13 and A12 as next AI chip nodes
    At its North America Technology Symposium, TSMC showcased a range of innovations in advanced process technologies. Following the introduction of its A14 process in 2025, the company...
    Thursday 23 April 2026
    GUC Announces 3nm 12 Gbps HBM4 PHY and Controller

    Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology...

    Friday 10 April 2026
    CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
    Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook