Uncertainty surrounding US President Donald Trump's tariff policy has rattled global supply chains and triggered downward revisions in growth forecasts for consumer electronics and...
TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary to recent market speculation about order reductions from...
At its 2025 North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that complements its 1.8nm (18A) process. From advanced...
C Sun Manufacturing is showcasing its advanced semiconductor, PCB, and panel-level packaging (PLP) equipment at Touch Taiwan 2025, emphasizing continued growth despite mounting concerns...
As a leader in advanced processes and the CoWoS and SoIC advanced packaging supply chain, Praise Victor Industrial (PVI) is benefited from the ongoing semiconductor expansion wave,...
Despite rumors of reduced orders for advanced packaging capacities, Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up its advanced packaging capacity to meet the growing...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...
Benefiting from strong demand for wafer carriers and photomask carriers from clients such as TSMC, Gudeng reported a consolidated revenue of approximately NT$456 million (US$13.9...
Market speculation about a slowdown in AI chip demand is mounting, with concerns fueled by scaled-back data center plans from major CPE manufacturers and downward revisions in CoWoS...
Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is expected to rise consistently with the addition of new...
TSMC's silicon photonic (SiPh) co-packaged optics (CPO) technology is progressing swiftly, with recent market speculation suggesting that related production lines are expected to...
OSAT leader ASE expects to enjoy a particularly strong first quarter of 2025, thanks to an influx of urgent orders for AI and PC applications. Advanced packaging is expected to drive...
In recent months, as the US has tightened its AI restrictions and unleashed disruptive tariff measures, many believe that TSMC will be the first to bear the brunt. However, after...
