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    China reportedly demands rare earth firms hand over tech staff data amid delays in lifting export curbs
    8min ago
    US and Japan establish EUV research centers while South Korea lags with older equipment
    54min ago
    Taiwan govt's mission for Micron: upgrade central region's smart manufacturing
    55min ago
    Niching optimistic on advanced packaging and substrate market in 2025
    55min ago
    ASML confident in high-NA EUV lithography with extensive supplier network
    55min ago
    China's auto market faces multiple crises, nearing central government's tolerance limit
    55min ago
    EFUN Technology advances water and gas barrier films for semiconductor packaging and OLED screens
    56min ago
    NEWS TAGGED COWOS
    Wednesday 25 June 2025
    Taiwan govt opens AI pilot lines to enhance CoWoS inspection efficiency
    Taiwan's government has instructed leading industrial research institutions, such as the Industrial Technology Research Institute (ITRI), the Metal Industries Research and Development...
    Monday 23 June 2025
    TSMC advanced packaging gains traction with Apple, Nvidia orders
    Advanced packaging continues to gain momentum, with the industry closely watching as TSMC not only secures large orders from Nvidia but also sees Apple joining the fray, clearly signaling...
    Thursday 12 June 2025
    Hota Industrial gears up for CoWoS inspection machine shipments in 2Q26
    Hota Industrial Manufacturing chairman David Shen is navigating a series of market variables, from tariffs to exchange rates. While Hota has been largely unaffected by tariffs, the...
    Wednesday 4 June 2025
    CoWoS material shortage triggers AI supply chain concerns; TSMC and ASE expected to receive priority access
    As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
    Monday 2 June 2025
    AIchip goes all in on CoWoS advanced packaging
    Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
    Tuesday 27 May 2025
    TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
    Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing...
    Tuesday 27 May 2025
    AI chips and CoWoS orders keep HPI’s outlook running hot
    Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...
    Monday 26 May 2025
    TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM
    Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...
    Monday 26 May 2025
    As Nvidia deepens roots in Taipei, Taiwan launches push to attract global talent

    Nvidia CEO Jensen Huang delivered a powerful message at the company's GTC global press conference in Taipei this week: the key to Nvidia's...

    Thursday 22 May 2025
    Nvidia's Taiwan inner circle powers up for the Blackwell era
    During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
    Monday 19 May 2025
    The beauty and sorrow of a one-man stage: TSMC's advanced process technology and packaging
    From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April,...
    Monday 19 May 2025
    ART confirms normal operations after hacker attack, no confidential data compromised
    Semiconductor equipment manufacturer All-Ring Tech (ART) recently reported a significant cybersecurity incident involving the leakage of internal data by external hackers. ART stated...
    Tuesday 6 May 2025
    Tariff tensions delay ABF substrate recovery as Unimicron shifts focus to CoWoS clients
    Uncertainty surrounding US President Donald Trump's tariff policy has rattled global supply chains and triggered downward revisions in growth forecasts for consumer electronics and...
    Wednesday 30 April 2025
    TSMC's AI chip plans remain on track; CoWoS capacity to double in 2025
    TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary to recent market speculation about order reductions from...
    Monday 28 April 2025
    FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

    As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

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    Research Report Database
    BIZ FOCUS
    Jun 20, 10:14
    2025 AI with purpose global summit debuts in Taipei, gathering over 40 leaders from 10 countries to launch global dialogue on AI and sustainability
    Tuesday 17 June 2025
    Cybersecurity regulations and standards: Best practices and latest challenges
    Tuesday 17 June 2025
    Partnership of ASUS and Far Eastern Memorial Hospital creates new benchmark in health management through wearable technology
    Tuesday 17 June 2025
    From Discord to digital wallets: Transformation of interactive gaming communities
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES