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    Lumentum sees explosive expansion as AI demand fuels record results
    18min ago
    GlobalFoundries signals stronger second half despite mixed end-market demand
    37min ago
    Low-cost cruise missiles drive a new drone cost race
    May 5, 17:34
    Taiwan drone makers expand into Eastern Europe as Ukraine cuts China supply risk
    May 5, 17:34
    China’s AI industry accelerates shift to Huawei’s Ascend ecosystem
    May 5, 17:34
    Why did memory price surge hits Samsung mobile profits while Apple still posts record gains
    May 5, 17:34
    Hyundai Motor Group pushes ecosystem strategy beyond humanoid robot hype
    May 5, 17:34
    Nvidia and AMD deepens Taiwan-US strategic economic ties
    May 5, 17:30
    NEWS TAGGED COWOS
    Tuesday 5 May 2026
    Analysis: CoWoS crunch and MediaTek's hire raise a bigger question — can Intel deliver?
    The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...
    Friday 24 April 2026
    TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker
    The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
    Thursday 23 April 2026
    TSMC targets 2029 production for A13 and A12 as next AI chip nodes
    At its North America Technology Symposium, TSMC showcased a range of innovations in advanced process technologies. Following the introduction of its A14 process in 2025, the company...
    Thursday 23 April 2026
    GUC Announces 3nm 12 Gbps HBM4 PHY and Controller

    Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology...

    Friday 10 April 2026
    CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
    Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
    Tuesday 7 April 2026
    Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

    AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

    Wednesday 1 April 2026
    TSMC eyes SiPh breakthrough as industry consensus forms
    TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
    Friday 20 March 2026
    Intel pushes large-area AI packaging to close foundry gap
    Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
    Friday 13 March 2026
    Apple's Mac Neo gambit: when volume alone can't hold the TSMC crown
    The semiconductor landscape is undergoing a fundamental shift, moving from a mobile-first volume game to an AI-driven value competition.
    Wednesday 11 March 2026
    Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch
    Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...
    Friday 6 March 2026
    Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment
    The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...
    Thursday 5 March 2026
    TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties
    TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront...
    Thursday 26 February 2026
    Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
    All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
    Wednesday 25 February 2026
    ASE accelerates panel-level packaging push with fully automated 310mm line by 2026
    AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
    Monday 2 February 2026
    SMIC reportedly sets up advanced packaging research institute in Shanghai
    As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook