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    Taiwan IPC makers seek tech giant backing among AI boom
    5min ago
    VS Industry reports sales decline in 3Q25 amid profit pressure
    9min ago
    Tariffs shield US battery manufacturing: opportunities and challenges
    Jun 12, 17:45
    Samsung and LG lead AI TV innovation to outpace Chinese brands
    Jun 12, 17:45
    Maxscend breaks filter technology barriers, advancing China's RF IC industry
    Jun 12, 17:44
    NEWS TAGGED COWOS
    Thursday 12 June 2025
    Hota Industrial gears up for CoWoS inspection machine shipments in 2Q26
    Hota Industrial Manufacturing chairman David Shen is navigating a series of market variables, from tariffs to exchange rates. While Hota has been largely unaffected by tariffs, the...
    Wednesday 4 June 2025
    CoWoS material shortage triggers AI supply chain concerns; TSMC and ASE expected to receive priority access
    As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
    Monday 2 June 2025
    AIchip goes all in on CoWoS advanced packaging
    Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
    Tuesday 27 May 2025
    TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
    Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing...
    Tuesday 27 May 2025
    AI chips and CoWoS orders keep HPI’s outlook running hot
    Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...
    Monday 26 May 2025
    TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM
    Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...
    Monday 26 May 2025
    As Nvidia deepens roots in Taipei, Taiwan launches push to attract global talent

    Nvidia CEO Jensen Huang delivered a powerful message at the company's GTC global press conference in Taipei this week: the key to Nvidia's...

    Thursday 22 May 2025
    Nvidia's Taiwan inner circle powers up for the Blackwell era
    During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
    Monday 19 May 2025
    The beauty and sorrow of a one-man stage: TSMC's advanced process technology and packaging
    From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April,...
    Monday 19 May 2025
    ART confirms normal operations after hacker attack, no confidential data compromised
    Semiconductor equipment manufacturer All-Ring Tech (ART) recently reported a significant cybersecurity incident involving the leakage of internal data by external hackers. ART stated...
    Tuesday 6 May 2025
    Tariff tensions delay ABF substrate recovery as Unimicron shifts focus to CoWoS clients
    Uncertainty surrounding US President Donald Trump's tariff policy has rattled global supply chains and triggered downward revisions in growth forecasts for consumer electronics and...
    Wednesday 30 April 2025
    TSMC's AI chip plans remain on track; CoWoS capacity to double in 2025
    TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary to recent market speculation about order reductions from...
    Monday 28 April 2025
    FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

    As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

    Thursday 24 April 2025
    What TSMC revealed at 2025 Symposium
    At its 2025 North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that complements its 1.8nm (18A) process. From advanced...
    Friday 18 April 2025
    C Sun poised to join US semiconductor expansion wave
    C Sun Manufacturing is showcasing its advanced semiconductor, PCB, and panel-level packaging (PLP) equipment at Touch Taiwan 2025, emphasizing continued growth despite mounting concerns...
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    Research Report Database
    BIZ FOCUS
    Jun 10, 13:38
    SK Hynix presents future DRAM technology roadmap at IEEE VLSI 2025
    Tuesday 10 June 2025
    Struggling to enhance chip test performance? Let's explore solutions!
    Tuesday 10 June 2025
    Ensuring SoC integration: The role of Eurosmart PP0117
    Monday 9 June 2025
    Linxens teams up with Dracula Technologies to develop battery-free smart labels for next-gen sustainable IoT
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES