News tagged CoWoS at DIGITIMES

NEWS TAGGED COWOS

Saturday 5 September 2026

TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain

TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...

Friday 4 September 2026

K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap

Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...

Wednesday 2 September 2026

TSMC moves into Baipu Industrial Park, boosts advanced packaging

TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...

Tuesday 1 September 2026

TSMC delays CoWoS orders as CoPoS plans take shape

TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...

Saturday 29 August 2026

Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?

As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...

Thursday 27 August 2026

Google, MediaTek embrace advanced packaging diversification

Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...

Wednesday 26 August 2026

TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation

Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...

Monday 24 August 2026

AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint

AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...

Friday 21 August 2026

CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth

Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...

Tuesday 18 August 2026

Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging...

Wednesday 12 August 2026

OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year

AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...

Tuesday 11 August 2026

OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year

AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...

Thursday 6 August 2026

TSMC's CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck

Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...

Friday 31 July 2026

TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026

Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...

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Sep 11, 08:00

DAS Expands in Taiwan and Unveils World First at SEMICON

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