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    ODM/EMS March revenue surged driven by AI server demand
    9h 41min ago
    Glass substrate moves from R&D to mass production
    9h 41min ago
    JCET advances in advanced packaging with CPO samples shipped and large glass substrate validation
    9h 41min ago
    Huawei backs North Ocean Photonics to boost domestic optical chip autonomy
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    China's auto market faces fierce competition amid cooling demand
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    Apple increased foldable display inventory by 20% ahead of iPhone Fold launch
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    NEWS TAGGED COWOS
    Friday 10 April 2026
    CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
    Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
    Tuesday 7 April 2026
    Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

    AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

    Wednesday 1 April 2026
    TSMC eyes SiPh breakthrough as industry consensus forms
    TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
    Friday 20 March 2026
    Intel pushes large-area AI packaging to close foundry gap
    Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
    Friday 13 March 2026
    Apple's Mac Neo gambit: when volume alone can't hold the TSMC crown
    The semiconductor landscape is undergoing a fundamental shift, moving from a mobile-first volume game to an AI-driven value competition.
    Wednesday 11 March 2026
    Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch
    Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...
    Friday 6 March 2026
    Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment
    The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...
    Thursday 5 March 2026
    TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties
    TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront...
    Thursday 26 February 2026
    Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
    All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
    Wednesday 25 February 2026
    ASE accelerates panel-level packaging push with fully automated 310mm line by 2026
    AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
    Monday 2 February 2026
    SMIC reportedly sets up advanced packaging research institute in Shanghai
    As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
    Friday 30 January 2026
    ABF substrate crunch reshapes market: Unimicron leads and rivals close in

    AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

    Thursday 29 January 2026
    Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
    The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
    Thursday 15 January 2026
    TSMC retains pricing power using Apple and AI dual structure
    Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
    Monday 12 January 2026
    TSMC expands advanced packaging, reportedly set to name first 'general plant manager'
    TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant manager" to oversee all facilities. The role is expected...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook