The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
Cloud GPUs have seen massive growth under the current AI boom, with the annual growth rate of high-end cloud GPUs in 2024 to reach 217% if both supply and demand hold steady, says...
The 2024 International Semiconductor Exhibition (SEMICON Taiwan) is set to launch on September 4, focusing on semiconductor technologies crucial to the emerging AI era.
TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...
At the close of 2023, Innolux shuttered its 5.5-generation LCD panel facility. Reports suggest that potential buyers for this plant include Micron and TSMC. Recently, TSMC has reportedly...
FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the secondgen AI accelerator, RNGD (pronounced "Renegade"), the most...
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing...
C. C. Wei, chairman and CEO of TSMC, introduced the concept of "Foundry 2.0" and provided additional information regarding the company's advanced 2nm and A16 process technologies...
The 34th Academia Sinica academician and honorary academician election recently welcomed 28 new members, including Douglas Yu, Vice President of Pathfinding for System Integration...
As Apple prepares to launch its first AI smartphone in September, the third quarter is expected to see a surge in stocking demand. This has not only pushed TSMC's market value to...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
