In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
IC equipment and materials suppliers have seen a surge in demand from China's semiconductor industry, where companies are rushing to adopt HBM memory and CoWoS-like technology, according...
TSMC's second-quarter sales may surpass the target, seeing customers' AI and HPC-related orders flowing in. In July, chips for Apple's iPhone 16 and Intel's 3nm chips will start mass...
In a strategic move to bolster AI semiconductor competitiveness, SK Group Chairman Chey Tae-won and SK Hynix President Kwak Noh-Jun made a whirlwind visit to Taiwan on June 6.
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
The explosive growth in Generative AI (GenAI) business opportunities spurred by ChatGPT drives the demand for hardware and software related to the GenAI supply chain. TSMC, the sole...
PSMC, a Taiwan-based semiconductor foundry service provider, inaugurates its first 12-inch wafer fab in Miaoli, Taiwan on May 2. At the ceremony venue, PSMC chairman Frank Huang said...
Equipment makers have seen the visibility of TSMC's order extended to 2025, and Intel and OSATs have also placed orders, according to industry sources in Taiwan.
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
