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Friday 19 April 2024
TSMC lowers 2024 semiconductor, foundry outlook
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...
Monday 8 April 2024
Samsung's advanced packaging reportedly grabs Nvidia orders amid competition with TSMC
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
Tuesday 2 April 2024
TSMC places additional equipment orders for CoWoS packaging
TSMC has placed more equipment orders to boost its CoWoS packaging manufacturing capability, according to sources at fab toolmakers.
Wednesday 27 March 2024
Taiwan wafer foundry industry, 1Q 2024

Introduction

Thursday 21 March 2024
Nvidia CEO reiterates solid partnership with TSMC
One key takeaway from the ongoing GTC is that Nvidia's AI empire has taken shape with strong partnerships from TSMC and other Taiwanese makers, such as those major server ODMs.
Wednesday 20 March 2024
Nvidia flexes AI muscle at GTC 2024
Nvidia founder and CEO Jensen Huang heralded the arrival of the AI era in a two-hour speech on March 18 at the company's GTC event.
Tuesday 19 March 2024
TSMC chooses CoWoS factory site while continuing 3nm capacity expansion
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Tuesday 19 March 2024
TSMC to build two advanced packaging fabs in southern Taiwan
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Thursday 14 March 2024
Taiwanese IC distributors to capitalize on handset and PC inventory shrinkage, AI chip boom in 2024
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
Thursday 7 March 2024
Backend houses gearing up for AI chip boom
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
Tuesday 5 March 2024
UMC and PSMC cut into supply chain for AI chips
Pure-play foundries United Microelectronics (UMC) and Powerchip Semiconductor Manufacturing (PSMC) have received orders for Si interposers, allowing them to enter the supply chain...
Monday 4 March 2024
Weekly news roundup: SMIC plans 5nm chip production expansion for Huawei amid US sanctions
These are the most-read DIGITIMES Asia stories from February 26 – March 1.
Friday 1 March 2024
TSMC ramping up CoWoS capacity
TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which...
Thursday 22 February 2024
AI server reality check: Foxconn's Young Liu raises doubts amidst industry hype
In 2023, AI took the global tech scene by storm, not just lighting up the tech industry's dim outlook but also emerging as a linchpin for supply chain players eyeing a market resur...
Wednesday 21 February 2024
AI to boost advanced packaging demand
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research