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NEWS TAGGED COWOS
Tuesday 2 July 2024
Chinese manufacturers to benefit from CoWoS-like structures and TSMC order surplus
Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...
Tuesday 2 July 2024
Huawei is developing HBM with Wuhan XMC: media
Rumors from various sources said Huawei is partnering with Wuhan XMC to develop high bandwidth memory (HBM) to meet the robust demand for Artificial Intelligence (AI).
Friday 28 June 2024
China's HBM demands account for 7% of 2024 global total
High Bandwidth Memory (HBM) is becoming the core of the High-Performance Computing (HPC) arms race.
Thursday 27 June 2024
China sees bumpy road ahead for homegrown HBM development, lagging memory giants by 10 years
China's development of homegrown High Bandwidth Memory (HBM) has a long way to go, lagging behind international memory giants by 10 years.
Thursday 27 June 2024
Equipment makers see demand boom for TSMC CoWoS packaging
With TSMC planning to boost production capacity for CoWoS packaging, related fab toolmakers are confident about orders from the contract chipmaker.
Tuesday 25 June 2024
Taiwan OSATs to see sales growth in 2H24
Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...
Monday 24 June 2024
Innolux, OSATs stepping up FOPLP deployment
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
Friday 21 June 2024
Chinese OSATs gear up for advanced packaging
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
Thursday 20 June 2024
Server AI accelerator market and technology

Introduction

Thursday 20 June 2024
Fab toolmakers see strong demand for HBM, CoWoS-like from China
IC equipment and materials suppliers have seen a surge in demand from China's semiconductor industry, where companies are rushing to adopt HBM memory and CoWoS-like technology, according...
Tuesday 18 June 2024
Taiwan wafer foundry industry, 2Q 2024

Introduction

Monday 17 June 2024
Fab tool and equipment suppliers benefit from TSMC 2H24 business boom
TSMC's second-quarter sales may surpass the target, seeing customers' AI and HPC-related orders flowing in. In July, chips for Apple's iPhone 16 and Intel's 3nm chips will start mass...
Thursday 13 June 2024
HBM competition (2): The choice of HBM's next steps?
It is important to know how individual memory companies choose to develop their High Bandwidth Memory (HBM) technology for future competitions.
Tuesday 11 June 2024
CEOs of Nvidia, TSMC meet for 3/2nm, CoWoS manufacturing
Nvidia CEO Jensen Huang attended Computex 2024 in Taipei last week, sparking an AI frenzy in Taiwan.
Friday 7 June 2024
SK top executives visit TSMC's new chairman in secret mission
In a strategic move to bolster AI semiconductor competitiveness, SK Group Chairman Chey Tae-won and SK Hynix President Kwak Noh-Jun made a whirlwind visit to Taiwan on June 6.