Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
One key takeaway from the ongoing GTC is that Nvidia's AI empire has taken shape with strong partnerships from TSMC and other Taiwanese makers, such as those major server ODMs.
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
Pure-play foundries United Microelectronics (UMC) and Powerchip Semiconductor Manufacturing (PSMC) have received orders for Si interposers, allowing them to enter the supply chain...
TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which...
In 2023, AI took the global tech scene by storm, not just lighting up the tech industry's dim outlook but also emerging as a linchpin for supply chain players eyeing a market resur...
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
