Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane,...
TSMC continues to expand its CoWoS packaging capacity despite recent market rumors suggesting Nvidia has scaled back its orders with the foundry for 2024, according to industry sou...
IC testing interface specialist WinWay Technology is full steam ahead with new products, holding a "very optimistic" outlook for the second half of 2024, according to the Taiwan-based...
Fab toolmaker All Ring Tech, which is reportedly involved in the supply chain for TSMC's chip-on-wafer-on-substrate (CoWoS) packaging, is expected to post significant revenue growth...
TSMC not only offers advanced process manufacturing but also its advanced packaging for the recently released Microsoft Azure Maia 100 AI accelerator, according to industry sources...
Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee Industrial, among others, have observed an increase in demand for IC packaging materials and are generally...
The easing of server GPU and CoWoS packaging supply shortages will boost AI server shipments in 2024, according to DIGITIMES Research senior analyst Jim Hsiao.
The ban on exports to China has been upgraded, not only expanding the range of AI chip specifications but also not giving Chinese companies time to stock up. It is worth noting that...
Robust demand for CoWoS and other advanced packaging will positively contribute to C Sun Manufacturing's sales operations in the second half of this year, according to the semiconductor...
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...
