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Tuesday 26 September 2023
OSATs gearing up for heterogeneous integration boom in 2024
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Tuesday 19 September 2023
Packaging material distributors see stable demand for automotive, advanced packaging
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
Monday 11 September 2023
TSMC's CoWoS begins third wave of additional orders; CTSP becomes hotspot for latest expansion
According to semiconductor equipment suppliers, TSMC has reportedly begun its third wave of additional equipment orders since the second quarter, injecting life into the related equipment...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Friday 8 September 2023
IC packaging material suppliers to capitalize on CoWoS surge
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
Friday 8 September 2023
ODMs see general-purpose server demand remain sluggish
General-purpose server demand remains sluggish despite strong demand for AI servers, according to sources at ODMs.
Thursday 7 September 2023
TSMC expanding CoWoS packaging capacity
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Thursday 31 August 2023
Topco Scientific expands product offerings to CoWoS and 3D IC
Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...
Thursday 24 August 2023
AI server shipments forecast to top 300,000 units in 2024, says DIGITIMES Research
High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...
Tuesday 22 August 2023
Advanced packaging capacity to surge 30–40% in 2024, says TrendForce
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Friday 18 August 2023
Advanced packaging becomes next battlefield for Intel and TSMC
The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.
Tuesday 15 August 2023
TSMC caters to AI GPU chip customers to meet market demand
Since ChatGPT ignited a race among competitors to develop their generative AI system in early 2023, the high-computing power demand has pushed up the sales of AI GPUs.
Monday 14 August 2023
Re-exploring Samsung's advanced packaging strategy through the Amkor acquisition rumors
The AI trend is now a worldwide phenomenon, with Nvidia CEO Jensen Huang even declaring that "Nvidia is betting everything on AI." In 2023, the AI server supply chain became one of...
Wednesday 9 August 2023
Wah Lee sees robust AI-triggered demand for semiconductor materials supporting advanced packaging
Semiconductor materials distributor Wah Lee Industrial has enjoyed robust orders catering to customers' advanced packaging needs, such as TSMC's CoWoS, as a result of the AI server...