Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...
High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Since ChatGPT ignited a race among competitors to develop their generative AI system in early 2023, the high-computing power demand has pushed up the sales of AI GPUs.
The AI trend is now a worldwide phenomenon, with Nvidia CEO Jensen Huang even declaring that "Nvidia is betting everything on AI." In 2023, the AI server supply chain became one of...
Semiconductor materials distributor Wah Lee Industrial has enjoyed robust orders catering to customers' advanced packaging needs, such as TSMC's CoWoS, as a result of the AI server...
Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
TSMC is planning to invest nearly NT$90 billion (US$2.85 billion) to establish an advanced chip packaging plant in Miaoli, northern Taiwan with the facility scheduled to begin volume...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
One of AMD CEO Lisa Su's priorities for her planned mid-July visit to Taiwan will be securing TSMC's available CoWoS packaging capacity, according to sources with knowledge of the...
