Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...

TSMC is expected to see a significant revenue rebound in the second half of the year, which will be driven by not only the launch of new iPhones but also strong demand for AI chips...

Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...

Nvidia CEO Jensen Huang's exclamation of the arrival of "AI's iPhone moment" sparked an explosive demand for AI HPC (high-performance computing) chips. For 2.5D advanced packaging...

TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...

AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,

Integrated Service Technology (iST), a specialist in IC materials analysis, has reported a 10.2% increase in revenue year-over-year from January to May, thanks to robust reliability...

Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has reiterated its close collaboration with significant North American clients, which will become evident in the third...

With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...

TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.

TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.

Nvidia has announced the launch of a new class of large-memory AI supercomputer, the Nvidia DGX, powered by Nvidia's GH200 Grace Hopper superchips and the Nvidia NVLink Switch System,...

Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...

Nvidia has placed additional orders for AI chips that require TSMC's CoWoS (chip on wafer on substrate) packaging, according to industry sources.

At its 2023 North America Technology Symposium, TSMC showcased progress in its 2nm technology and new 3nm process variants, including an improved N3E.