With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Since ChatGPT ignited a race among competitors to develop their generative AI system in early 2023, the high-computing power demand has pushed up the sales of AI GPUs.
The AI trend is now a worldwide phenomenon, with Nvidia CEO Jensen Huang even declaring that "Nvidia is betting everything on AI." In 2023, the AI server supply chain became one of...
Semiconductor materials distributor Wah Lee Industrial has enjoyed robust orders catering to customers' advanced packaging needs, such as TSMC's CoWoS, as a result of the AI server...
Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
TSMC is planning to invest nearly NT$90 billion (US$2.85 billion) to establish an advanced chip packaging plant in Miaoli, northern Taiwan with the facility scheduled to begin volume...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
One of AMD CEO Lisa Su's priorities for her planned mid-July visit to Taiwan will be securing TSMC's available CoWoS packaging capacity, according to sources with knowledge of the...
Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...
TSMC is expected to see a significant revenue rebound in the second half of the year, which will be driven by not only the launch of new iPhones but also strong demand for AI chips...
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
Nvidia CEO Jensen Huang's exclamation of the arrival of "AI's iPhone moment" sparked an explosive demand for AI HPC (high-performance computing) chips. For 2.5D advanced packaging...
