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Wednesday 14 June 2023
TSMC CoWoS attracts orders from major HPC and network processor vendors
AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,
Monday 12 June 2023
Strong reliability analysis demand for advanced packaging buoys iST revenue
Integrated Service Technology (iST), a specialist in IC materials analysis, has reported a 10.2% increase in revenue year-over-year from January to May, thanks to robust reliability...
Monday 12 June 2023
Alchip reiterates close collaboration with US clients
Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has reiterated its close collaboration with significant North American clients, which will become evident in the third...
Monday 12 June 2023
TSMC on track to double CoWoS capacity for AI GPU/HPC chips
With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...
Tuesday 6 June 2023
TSMC rushes to increase packaging capacity for Nvidia AI chips
TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.
Tuesday 30 May 2023
Advanced packaging demand for AI and HPC processors to rise
TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
Monday 29 May 2023
New Nvidia generative AI chip employs TSMC CoWoS
Nvidia has announced the launch of a new class of large-memory AI supercomputer, the Nvidia DGX, powered by Nvidia's GH200 Grace Hopper superchips and the Nvidia NVLink Switch System,...
Monday 22 May 2023
ASE lands Broadcom orders for silicon photonics-based networking chips
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Thursday 11 May 2023
Nvidia places additional orders requiring TSMC CoWoS
Nvidia has placed additional orders for AI chips that require TSMC's CoWoS (chip on wafer on substrate) packaging, according to industry sources.
Thursday 27 April 2023
TSMC talks about enhanced N3E and other 3nm variants
At its 2023 North America Technology Symposium, TSMC showcased progress in its 2nm technology and new 3nm process variants, including an improved N3E.
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Thursday 2 March 2023
Microsoft reportedly mulls utilizing TSMC CoWoS for AI chip
Microsoft has reportedly approached TSMC and its ecosystem partners about using the foundry's CoWoS packaging for its own AI chip, according to industry sources.
Thursday 2 March 2023
High-end AI chip boom to spur demand for TSMC CoWoS packaging
A surge in high-end AI chip demand spurred by the growing popularity of ChatGPT is expected to drive demand for TSMC's CoWoS packaging, according to industry sources.
Thursday 8 December 2022
OSATs still uncertain about constructing facilities in US
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...
Thursday 10 November 2022
AMD to utilize TSMC CoWoS for next-gen datacenter accelerator
AMD will utilize TSMC's CoWoS packaging for the next generation of its datacenter accelerators, according to industry sources.
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research