Robust demand for CoWoS and other advanced packaging will positively contribute to C Sun Manufacturing's sales operations in the second half of this year, according to the semiconductor...
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
According to semiconductor equipment suppliers, TSMC has reportedly begun its third wave of additional equipment orders since the second quarter, injecting life into the related equipment...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...
High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
