TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
Pure-play foundries United Microelectronics (UMC) and Powerchip Semiconductor Manufacturing (PSMC) have received orders for Si interposers, allowing them to enter the supply chain...
TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which...
In 2023, AI took the global tech scene by storm, not just lighting up the tech industry's dim outlook but also emerging as a linchpin for supply chain players eyeing a market resur...
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Nvidia's many customers, including Open AI CEO Sam Altman, are trying to find ways to cut dependency on its AI chips. While specialists have pointed out that Altman's lack of understanding...
AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...
A significant ramp-up in CoWoS production capacity at TSMC is anticipated to propel server companies' AI server sales to new heights in 2024, according to industry sources.
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
