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Wednesday 15 November 2023
AI server shipments to rise in 2024 as supply shortages ease
The easing of server GPU and CoWoS packaging supply shortages will boost AI server shipments in 2024, according to DIGITIMES Research senior analyst Jim Hsiao.
Monday 6 November 2023
Weekly news roundup: ASML's DUV installing progress in China and other top stories
These are the most-read articles during the week of October 30-November 3:
Friday 3 November 2023
Alchip to see 4Q23 revenue rise
Taiwan-based Alchip Technologies, dedicated to supplying ASICs, expects to see its fourth-quarter revenue hit a peak for 2023 in the fourth quarter.
Monday 30 October 2023
TSMC CoWoS capacity crucial to the AI GPU race between AMD and Nvidia
The ban on exports to China has been upgraded, not only expanding the range of AI chip specifications but also not giving Chinese companies time to stock up. It is worth noting that...
Wednesday 25 October 2023
AI to boost terminal device replacement
AI will drive demand for PC, handset, and other terminal device replacements, according to sources at chipmakers.
Tuesday 24 October 2023
Equipment supplier C Sun upbeat about advanced packaging demand
Robust demand for CoWoS and other advanced packaging will positively contribute to C Sun Manufacturing's sales operations in the second half of this year, according to the semiconductor...
Wednesday 11 October 2023
TSMC to maintain 2023 outlook despite stronger 3Q
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...
Tuesday 26 September 2023
OSATs gearing up for heterogeneous integration boom in 2024
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Tuesday 19 September 2023
Packaging material distributors see stable demand for automotive, advanced packaging
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
Monday 11 September 2023
TSMC's CoWoS begins third wave of additional orders; CTSP becomes hotspot for latest expansion
According to semiconductor equipment suppliers, TSMC has reportedly begun its third wave of additional equipment orders since the second quarter, injecting life into the related equipment...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Friday 8 September 2023
IC packaging material suppliers to capitalize on CoWoS surge
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
Friday 8 September 2023
ODMs see general-purpose server demand remain sluggish
General-purpose server demand remains sluggish despite strong demand for AI servers, according to sources at ODMs.
Thursday 7 September 2023
TSMC expanding CoWoS packaging capacity
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research