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Tuesday 19 March 2024
TSMC chooses CoWoS factory site while continuing 3nm capacity expansion
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Tuesday 19 March 2024
TSMC to build two advanced packaging fabs in southern Taiwan
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Thursday 14 March 2024
Taiwanese IC distributors to capitalize on handset and PC inventory shrinkage, AI chip boom in 2024
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
Thursday 7 March 2024
Backend houses gearing up for AI chip boom
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
Tuesday 5 March 2024
UMC and PSMC cut into supply chain for AI chips
Pure-play foundries United Microelectronics (UMC) and Powerchip Semiconductor Manufacturing (PSMC) have received orders for Si interposers, allowing them to enter the supply chain...
Monday 4 March 2024
Weekly news roundup: SMIC plans 5nm chip production expansion for Huawei amid US sanctions
These are the most-read DIGITIMES Asia stories from February 26 – March 1.
Friday 1 March 2024
TSMC ramping up CoWoS capacity
TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which...
Thursday 22 February 2024
AI server reality check: Foxconn's Young Liu raises doubts amidst industry hype
In 2023, AI took the global tech scene by storm, not just lighting up the tech industry's dim outlook but also emerging as a linchpin for supply chain players eyeing a market resur...
Wednesday 21 February 2024
AI to boost advanced packaging demand
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Thursday 15 February 2024
OpenAI's trillion-dollar chip plan can end well if right move is made
Nvidia's many customers, including Open AI CEO Sam Altman, are trying to find ways to cut dependency on its AI chips. While specialists have pointed out that Altman's lack of understanding...
Thursday 25 January 2024
OpenAI refuses to queue for AI chips; will build its fab faster to get them?
OpenAI CEO Sam Altman's plan to build...
Thursday 25 January 2024
APT opens new plant for advanced packaging process solutions
AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...
Wednesday 24 January 2024
TSMC CoWoS capacity expansion to support AI server sales
A significant ramp-up in CoWoS production capacity at TSMC is anticipated to propel server companies' AI server sales to new heights in 2024, according to industry sources.
Tuesday 23 January 2024
OpenAI's wishlist: billions, freedom from Nvidia, in-house AI chip production
OpenAI is exploring potential self-development and production.
Friday 19 January 2024
Backend houses bullish about advanced packaging demand
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.