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NEWS TAGGED COWOS
Friday 7 June 2024
SK top executives visit TSMC's new chairman in secret mission
In a strategic move to bolster AI semiconductor competitiveness, SK Group Chairman Chey Tae-won and SK Hynix President Kwak Noh-Jun made a whirlwind visit to Taiwan on June 6.
Wednesday 29 May 2024
Nvidia jumps to FOPLP for AI server chips amid CoWoS capacity strain
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
Tuesday 14 May 2024
Semiconductor materials orders driven by advanced processes, packaging demand
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
Monday 13 May 2024
TSMC places rush orders for CoWoS-related fab tools to meet global AI demand
The explosive growth in Generative AI (GenAI) business opportunities spurred by ChatGPT drives the demand for hardware and software related to the GenAI supply chain. TSMC, the sole...
Thursday 2 May 2024
PSMC Tongluo fab receives interposer order to fulfill AI demand
PSMC, a Taiwan-based semiconductor foundry service provider, inaugurates its first 12-inch wafer fab in Miaoli, Taiwan on May 2. At the ceremony venue, PSMC chairman Frank Huang said...
Tuesday 30 April 2024
Fab toolmakers see order visibility from TSMC extended to 2025
Equipment makers have seen the visibility of TSMC's order extended to 2025, and Intel and OSATs have also placed orders, according to industry sources in Taiwan.
Thursday 25 April 2024
TSMC debuts A16 technology at 2024 North America Technology Symposium
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
Tuesday 23 April 2024
Samsung's 2.5D packaging still has last mile to cross before getting Nvidia orders
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
Tuesday 23 April 2024
What factors lie behind system assembly changes for Nvidia's next-gen servers?
With Nvidia's recently announced Blackwell GPU architecture poised to become the mainstream for the next generation of AI servers, industry watchers expect Blackwell-equipped AI servers...
Monday 22 April 2024
Advanced packaging still in short supply; production expansion spreading overseas
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Friday 19 April 2024
TSMC lowers 2024 semiconductor, foundry outlook
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...
Monday 8 April 2024
Samsung's advanced packaging reportedly grabs Nvidia orders amid competition with TSMC
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
Tuesday 2 April 2024
TSMC places additional equipment orders for CoWoS packaging
TSMC has placed more equipment orders to boost its CoWoS packaging manufacturing capability, according to sources at fab toolmakers.
Wednesday 27 March 2024
Taiwan wafer foundry industry, 1Q 2024

Introduction

Thursday 21 March 2024
Nvidia CEO reiterates solid partnership with TSMC
One key takeaway from the ongoing GTC is that Nvidia's AI empire has taken shape with strong partnerships from TSMC and other Taiwanese makers, such as those major server ODMs.
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research