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Thursday 22 February 2024
AI server reality check: Foxconn's Young Liu raises doubts amidst industry hype
In 2023, AI took the global tech scene by storm, not just lighting up the tech industry's dim outlook but also emerging as a linchpin for supply chain players eyeing a market resur...
Wednesday 21 February 2024
AI to boost advanced packaging demand
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Thursday 15 February 2024
OpenAI's trillion-dollar chip plan can end well if right move is made
Nvidia's many customers, including Open AI CEO Sam Altman, are trying to find ways to cut dependency on its AI chips. While specialists have pointed out that Altman's lack of understanding...
Thursday 25 January 2024
OpenAI refuses to queue for AI chips; will build its fab faster to get them?
OpenAI CEO Sam Altman's plan to build...
Thursday 25 January 2024
APT opens new plant for advanced packaging process solutions
AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...
Wednesday 24 January 2024
TSMC CoWoS capacity expansion to support AI server sales
A significant ramp-up in CoWoS production capacity at TSMC is anticipated to propel server companies' AI server sales to new heights in 2024, according to industry sources.
Tuesday 23 January 2024
OpenAI's wishlist: billions, freedom from Nvidia, in-house AI chip production
OpenAI is exploring potential self-development and production.
Friday 19 January 2024
Backend houses bullish about advanced packaging demand
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Monday 15 January 2024
Weekly news roundup: Taiwan Defense Ministry mismatched missile warning causes alarm
These are the most-read DIGITIMES Asia stories in the week of January 8-12:
Wednesday 10 January 2024
GUC taped out UCIe 32G IP using TSMC 3nm and CoWoS technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane,...
Wednesday 10 January 2024
TSMC continues expanding CoWoS packaging capacity
TSMC continues to expand its CoWoS packaging capacity despite recent market rumors suggesting Nvidia has scaled back its orders with the foundry for 2024, according to industry sou...
Friday 24 November 2023
WinWay says outlook for 2H24 is very optimistic
IC testing interface specialist WinWay Technology is full steam ahead with new products, holding a "very optimistic" outlook for the second half of 2024, according to the Taiwan-based...
Thursday 23 November 2023
Equipment maker All Ring to embrace strong sales growth in 2024
Fab toolmaker All Ring Tech, which is reportedly involved in the supply chain for TSMC's chip-on-wafer-on-substrate (CoWoS) packaging, is expected to post significant revenue growth...
Wednesday 22 November 2023
Microsoft leverages TSMC's one-stop service for in-house developed chip
TSMC not only offers advanced process manufacturing but also its advanced packaging for the recently released Microsoft Azure Maia 100 AI accelerator, according to industry sources...
Wednesday 15 November 2023
IC packaging material distributors see demand pick up
Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee Industrial, among others, have observed an increase in demand for IC packaging materials and are generally...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research