The ultra-thin CULV notebook panel capacity of AU Optronics (AUO) is estimated to have reached 500,000 panels in May, according to market sources. AUO is currently showcasing its...

Intel recently added two dual-core CPUs into its CULV platform targeting entry-level ultra-thin notebooks – the Celeron 740 and SU2300, according to sources at notebook maker...

Acer will launch a Timeline series of ultra-thin notebooks with a screen size of 11.6 inches in July, with Quanta Computer to undertake OEM production, according to industry sources...

Acer has unveiled an ultra-thin business notebook, the TravelMate 8371, at the ongoing Computex 2009. The 13.3-inch TravelMate 8371 is built with an Intel Core 2 Duo processor and...

While Intel appears to be stepping away from the netbook market for the moment, ARM-based competitors are stepping in.

Intel has introduced four new processors, including a low-power version, and a value chipset, to usher in mainstream ultra-thin notebooks. Intel CULV processors will enable new consumer...

Acer's global notebook market share is expected to grow further since the company is leading its competitors by six to nine months in the CULV notebook market, according to company...

Hewlett-Packard (HP) plans to launch CULV-based notebooks using chassis designs from existing notebooks before introducing ultra-thin designs in the fourth quarter, according to sources...

Advence Printed Circuit Board (APCB) has received small traditional PCB orders for CULV notebooks. APCB began volume shipments in April, with Wistron one of its major customers, said...

Acer expects CULV-based ultra-thin notebooks will account for around 20% of its total notebook shipments in the future as consumer reaction toward the product line are mostly positive,...

Acer is reportedly cooperating with China-based telecom provider China Mobile to bundle its 13.3-inch CULV notebooks with mobile telecom subscriptions, according to market sources.

The supply of key notebook components may continue to worsen in the second half of 2009 leading to increasing costs, according to Alexander Hsu, president of Inventec's finance division...

Micro-Star International (MSI) has unveiled CULV-based X-Slim series notebooks and 12-inch Wind U series netbooks as well as Wind Top series all-in-one PCs. However, volume shipments...

Tripod Technology and Unimicron Technology took the lead in shipping HDI boards for CULV notebooks in April.

Taiwan-based notebook vendors including Acer, Asustek Computer and Micro-Star International (MSI), have all slowed down their volume shipment schedules for Intel CULV-based ultra-thin...