CONNECT WITH US
NEWS TAGGED CULV
Wednesday 15 April 2009
Intel CULV platform to help push LED-backlit notebook penetration to 70-80% in 2009
The launch of CULV (consumer ultra low voltage) ultra-thin notebooks is expected to boost the penetration rate of LED-backlit notebooks to 70-80% at the end of 2009 from 40% in early...
Tuesday 14 April 2009
Taiwan notebook maker rankings may shuffle in 2Q09
The ranking of Taiwan notebook makers in terms of shipments may see changes in the second quarter, according to market watchers.
Thursday 9 April 2009
Acer expects notebook shipments to grow 25-30% sequentially in 2Q09
Acer chairman JT Wang expects notebook shipments in the second quarter to grow 25-30% sequentially thanks to netbooks and the company's new Timeline ultra-thin notebook series.
Tuesday 7 April 2009
LCD makers gear up for CULV notebook panel development
LCD panel makers are gearing up to develop ultra-thin panels to go alone with Intel's consumer ultra low voltage-based (CULV-based) platform for notebooks, according to market sour...
Monday 6 April 2009
EMS and PCBA companies expected to increase investment in testing equipment as notebook HDI demand picks up
EMS and PCB assembly (PCBA) companies are purchasing testing equipment including AOI and AXI equipment in anticipation of increased demand for notebook-use high-density interconnect...
Wednesday 1 April 2009
Notebook PCB ASPs expected to raise on shift to HDI boards
Taiwan's PCB makers expect the shift to high-density interconnect (HDI) boards to help raise the ASPs of notebook PCBs, and are looking forward to the upcoming launch of ultra-thin...
Tuesday 31 March 2009
Compal eyeing CULV notebook market for 2H09, says paper
Compal Electronics president Ray Chen has pointed out that consumer ultra low voltage-based (CULV-based) ultra-thin notebooks will become a major battlefield for Compal in the second...
Tuesday 31 March 2009
HP to launch 13.3-inch CULV notebooks in 2Q09, sources say
Hewlett-Packard (HP) has plans to introduce several 13.3-inch consumer ultra low voltage-based (CULV-based) notebooks in the second quarter, with Quanta Computer and Compal Electronics...
Thursday 26 March 2009
Notebook vendors expected to push 13.3-inch segment initially for ultra-thin notebooks
The 13.3-inch panel segment is expected to become the mainstream size pushed by global notebook vendors for consumer ultra low voltage-based (CULV-based) ultra-thin notebooks, according...
Wednesday 25 March 2009
Intel aggressive in promoting CULV CPUs, say notebook makers
Intel is aggressively promoting sales of its upcoming consumer ultra low voltage (CULV) platform offering steep discounts to leading notebook vendors, according to notebook makers.
Wednesday 25 March 2009
PCB makers gear up for HDI boards used in low-cost notebooks
The upcoming launch of Intel's consumer ultra-low voltage (CULV) CPUs, which target ultra-portable notebooks priced between US$699-899, will help significantly increase demand for...
Friday 20 March 2009
Global notebook players to gain back market share with ultra-thin notebooks
The market shares of Taiwan-based notebook vendors Acer, Asustek Computer and Micro-Star International (MSI) are expected to be impacted as first-tier notebook vendors such as Dell...
Thursday 5 March 2009
Asustek evaluating Qualcomm platform Eee PCs
Asustek Computer is evaluating the possibility of developing Eee PCs that adopt Qualcomm's platform, however the company currently does not yet have any mass production plans for...
Wednesday 25 February 2009
Intel to launch new CPUs for ultra-thin notebooks
Intel plans to launch two new ultra low voltage (ULV) CPUs by the end of March this year mainly targeting the company's consumer ultra low voltage (CULV) platform for ultra-thin notebook...
Tuesday 24 February 2009
CeBIT 2009: Asustek and MSI to showcase CULV-based ultra-thin notebook
Asustek Computer and Micro-Star International (MSI) plan to showcase their Intel consumer ultra low voltage (CULV) platform-based ultra-thin notebooks at CeBIT this year, according...
megawin
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research