In a new wave of updated semiconductor regulations, Chinese GPU companies Shanghai Biren Intelligent Technology and Moore Threads Technology are added to the Entity List, which will...

Supply chain sources reported that Apple is working with suppliers to develop a foldable iPad, and small-scale production could begin as early as the end of 2024. This suggests that...

Today (October 18) marked the fourth annual Hon Hai Tech Day (HHTD) as the ceremony kicked off with a combined presentation by Nvidia CEO Jensen Huang and Hon Hai Technology (Foxconn)...

Custom ASIC development, initiated by tech giants, is now commonplace in the industry, benefiting both American and Taiwanese manufacturers. These tech giants maintain their in-house...

TSMC has stated that, given the current circumstances, the pure-play foundry will not consider investing in Longtan, northern Taiwan.

In the rapidly evolving semiconductor industry, the emergence of CXL (Compute Express Link) as an interconnect specification has captured the spotlight. Samsung Electronics and SK...

Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...

Industrial PC manufacturer Advantech has increased its investment in India, where it has expanded operations in Bangalore and plans to establish a software research and development...

Taiwan is lagging behind China in the development of compound semiconductors, but may catch up fast with sufficient government support, according to Taiwan's Photonic Industry and...

Electronic design automation (EDA) companies have sped up their development of 4nm radio-frequency IC (RFIC) designs.

Chinese MCU suppliers are actively expanding their target markets to include automotive and home AI edge device applications, looking to capitalize on the market development, according...

Blue Solutions, Foxconn (Hon Hai Technology Group), and Foxconn subsidiary SolidEdge Solution have decided to collaborate on the development of a solid-state battery ecosystem for...

Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...

At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...

Chipmakers including MediaTek, Realtek Semiconductor, RF IC specialist RichWave Technology, and power management IC (PMIC) supplier M3 Technology (M3Tek) are gearing up for the industry's...