Taiwan-based pure-play foundries continue to see orders for automotive semiconductors ramp up while stepping up their capacity expansion pace, according to industry sources.
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Kioxia has started sampling its new UFS Ver. 3.1 embedded flash memory devices for automotive, according to the company. The new lineup utilizes Kioxia's cutting-edge BiCS FLASH 3D...
Worldwide microprocessor sales grew 14% to a record-high US$102.9 billion in 2021, after climbing 16% in 2020, when COVID-induced lockdowns drove up demand for PCs, large-screen smartphones...
Kioxia has announced sampling of what the company claims is the industry's first universal flash storage (UFS) embedded flash memory devices supporting MIPI M-PHY v5.0 for a variety...
Touchscreen control IC specialist Elan Microelectronics has announced plans to invest in Chimei Motor Electronics, looking to jointly explore lucrative business opportunities for...
The global semiconductor industry generated sales of US$555.9 billion in 2021, up 26.2% compared to the 2020 total of US$440.4 billion, and hitting an annual high, according to the...
Kioxia has announced the launch of its Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology for applications...
ADLINK EGX-MXM-A1000, EGX-MXM-A2000 and EGX-MXM-A4500 are the first modules to use NVIDIA's embedded GPUs based on NVIDIA Ampere architecture. ADLINK embedded MXM graphics modules...
The overall DRAM bit supply growth is expected to decelerate in 2022, but demand for DDR5 memory could still be providing momentum, according to industry sources.
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
Unisoc has used Imagination Technologies' Series3NX neural network accelerator (NNA) IP in its new smartphone 5G platforms - Tanggula T770 and T760 system-on-chips (SoC), according...
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
AMD and MediaTek have jointly announced a collaboration to co-engineer industry-leading Wi-Fi solutions, starting with the AMD RZ600 series Wi-Fi 6E modules containing MediaTek's...
Adata Technology has said it remains upbeat about the DRAM market outlook next year, believing DRAM spot prices are about to hit bottom and start recovering. Fellow memory module...
