The overall DRAM bit supply growth is expected to decelerate in 2022, but demand for DDR5 memory could still be providing momentum, according to industry sources.
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
Unisoc has used Imagination Technologies' Series3NX neural network accelerator (NNA) IP in its new smartphone 5G platforms - Tanggula T770 and T760 system-on-chips (SoC), according...
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
AMD and MediaTek have jointly announced a collaboration to co-engineer industry-leading Wi-Fi solutions, starting with the AMD RZ600 series Wi-Fi 6E modules containing MediaTek's...
Adata Technology has said it remains upbeat about the DRAM market outlook next year, believing DRAM spot prices are about to hit bottom and start recovering. Fellow memory module...
China-based Yangtz Memory Technologies (YMTC) has shipped over 300 million 64-layer 3D NAND flash memory chips and is ready to volume produce 128-layer QLC (quad-level cell) NAND,...
Dialog Semiconductor has announced its power management ICs are selected for Xilinx's new Kria adaptive system-on-modules (SOMs) targeted for vision AI applications in smart cities...
The total microprocessor (MPU) market is on track to exceed US$100 billion for the first time ever this year, thanks to strong increases in cellphone application processor revenue,...
Kioxia America has announced the sampling of its newest generation of 256GB and 512GB Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices.
Memory module makers are poised to embrace brisk results in the third quarter of 2021, when the supply of memory chips remains tight, according to industry sources.
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
To counter the geopolitical challenge and reduce its dependence on the US, China is accelerating investment in next-generation enabling technologies. Against this backdrop, the country...
Samsung Electronics is looking to outsource the production of its memory controllers amid tight capacity at its own foundry, according to market sources.
