Samsung Electronics is looking to develop version 1.0 of the Universal Flash Storage (UFS) interface standard in the first half of 2011, in a move to standardize a command set required...
Grace Semiconductor Manufacturing has kicked off volume production of its 0.13-micron embedded flash solution, according to the Shanghai-based pure-play foundry.
Lanner Electronics has released the LEC-2026, an embedded system with a specialized focus on network capabilities. The LEC-2026 is driven by the N270 Intel Atom CPU and the Intel...
Already having impacted the automotive telephony, digital music and navigation segments, the smartphone is poised to have a greater influence on car infotainment systems in the future,...
Phison Electronics aims to ship 450 million NAND flash device controller ICs in 2010 to become one of the world's two largest suppliers, chairman Khein Seng Pua said at a recent company...
Memory module maker Kingston Technology has recently cut into the supply chain of High Tech Computer (HTC) with its in-house developed eMMC NAND flash memory device, which uses Toshiba's...
Microsoft has announced the release of the CTP (Community Technology Preview) version of Windows Embedded Compact 7, with the final version expected to be available at the end of...
Taiwan-based Apacer Technology is preparing an application to list on the Taiwan Stock Exchange in the fourth quarter of 2010, according to company president I-shih Chen. The memory...
Taiwan Semiconductor Manufacturing Company (TSMC) has announced its 0.18-micron automotive embedded flash IP that passed AEC-Q100 product qualification requirements for a wide range...
Flash memory solutions provider Spansion on May 10 announced it has emerged from Chapter 11 reorganization. During the reorganization, Spansion focused its business on serving embedded...
KatDC, a Taiwan-based developer of embedded IP multimedia software solutions based on Android or Linux and user interfaces for use in home-use and portable consumer electronics, is...
VIA Technologies has announced its Nano E-series processors, bringing native 64-bit software support, virtualization capabilities and extended longevity support to embedded markets...
Taiwan Semiconductor Manufacturing Company (TSMC) has shipped nearly 600,000 8-inch 0.25-micron AEC-Q100 qualified embedded flash (EmbFlash) wafers targeted at a wide variety of automotive...
STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...
China-based foundry Grace Semiconductor Manufacturing has launched an IP portfolio developed to assist customers in complementing their own IC design. The IP blocks offer various...
