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Friday 19 March 2010
Global sales of built-in 3G modules to exceed plug-type data cards in three years, say sources
Global sales of built-in 3G modules are expected to grow by an annual rate of over 30% in the next three years with their sales volume to surpass those of plug-type 3G data cards...
Friday 12 March 2010
eMemory teams up with MagnaChip to offer 0.11-micron embedded NVM
eMemory Technology has announced its Neobit one-time-programmable (OTP) memory built using 0.11-micron high-voltage production process entered volume production at MagnaChip Semiconductor...
Thursday 4 March 2010
VIA announce new embedded box PC for industrial applications
VIA Technologies has announced the VIA ART-3000, a fanless and rugged embedded box system based on the Em-ITX form factor motherboard, offering a solution for a variety of industrial...
Wednesday 3 March 2010
Lanner releases embedded system powered by Intel Atom D510
Lanner Electronics has launched the LEC-7100, a fanless industrial computer powered by the new dual core Intel Atom D510 processor at 1.66GHz. The LEC-7100 is designed to be easily...
Wednesday 3 February 2010
SMIC mass producing smart card chips for SHHIC
Semiconductor Manufacturing International Corporation (SMIC) has announced successful commercial production of a high-end contactless smart card chip designed by Shanghai Hua Hong...
Friday 22 January 2010
DTF 2010: AMD introduces new graphics module for embedded systems
AMD has introduced the ATI Radeon E4690 Mobile PCI Express module (MXM) for the graphics-intensive embedded systems at the Digitimes Tech Forum (DTF) 2010 in Taiwan.
Friday 8 January 2010
CES 2010: Intel unveils new Core processor family
Intel has introduced its new Intel Core family of processors for notebooks, desktops and embedded devices.
Wednesday 2 December 2009
VIA announces Mobile-ITX form factor to bring further miniaturization
VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices.
Monday 28 September 2009
AppliedMicro-TSMC partner on embedded processors
Applied Micro Circuits Corporation (AppliedMicro, formerly AMCC) and Taiwan Semiconductor Manufacturing Company (TSMC) have jointly announced a collaboration enabling AppliedMicro's...
Tuesday 22 September 2009
AMD delivers new platform solution for enterprise-class embedded systems
AMD has announced immediate availability of a new enterprise-class embedded platform based on the quad-core AMD Opteron processor and new AMD SR5690/SP5100 server chipset.
Monday 14 September 2009
Cypress revolutionizes embedded design with high performance, low power PSoC programmable SoC architectures
SAN JOSE, Calif., September 14, 2009 - Cypress Semiconductor Corp. (NYSE: CY) today announced two new architectures in its PSoC programmable system-on-chip platform that dramatically...
Monday 17 August 2009
Spansion to seek debt-for-equity swap to ease financial pressure, says executive
Spansion's financial restructuring following its exit from Chapter 11 will involve a debt-for-equity swap, according to John Nation, director of corporate marketing for the NOR flash...
Wednesday 12 August 2009
AMD adds new dual-core CPUs to embedded BGA client platform
AMD has announced immediate availability of two new dual-core, 18W TDP processors for the scalable ASB1 BGA embedded client platform, the Turion Neo X2 processor Model L625 and the...
Monday 10 August 2009
eMemory extends IP solutions to 65nm, partnering with Chartered
eMemory Technology, a Taiwan-based provider of IP for logic embedded non-volatile memory (NVM), has announced its 65nm Neobit one-time-programmable (OTP) memory is scheduled to enter...
Wednesday 24 June 2009
Samsung and Numonyx join forces on phase change memory
Samsung Electronics and Numonyx have announced they are jointly developing market specifications for phase change memory (PCM) products, which feature faster read and write speeds...