Flash memory solutions provider Spansion on May 10 announced it has emerged from Chapter 11 reorganization. During the reorganization, Spansion focused its business on serving embedded...

KatDC, a Taiwan-based developer of embedded IP multimedia software solutions based on Android or Linux and user interfaces for use in home-use and portable consumer electronics, is...

VIA Technologies has announced its Nano E-series processors, bringing native 64-bit software support, virtualization capabilities and extended longevity support to embedded markets...

Taiwan Semiconductor Manufacturing Company (TSMC) has shipped nearly 600,000 8-inch 0.25-micron AEC-Q100 qualified embedded flash (EmbFlash) wafers targeted at a wide variety of automotive...

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...

China-based foundry Grace Semiconductor Manufacturing has launched an IP portfolio developed to assist customers in complementing their own IC design. The IP blocks offer various...

Global sales of built-in 3G modules are expected to grow by an annual rate of over 30% in the next three years with their sales volume to surpass those of plug-type 3G data cards...

eMemory Technology has announced its Neobit one-time-programmable (OTP) memory built using 0.11-micron high-voltage production process entered volume production at MagnaChip Semiconductor...

VIA Technologies has announced the VIA ART-3000, a fanless and rugged embedded box system based on the Em-ITX form factor motherboard, offering a solution for a variety of industrial...

Lanner Electronics has launched the LEC-7100, a fanless industrial computer powered by the new dual core Intel Atom D510 processor at 1.66GHz. The LEC-7100 is designed to be easily...

Semiconductor Manufacturing International Corporation (SMIC) has announced successful commercial production of a high-end contactless smart card chip designed by Shanghai Hua Hong...

AMD has introduced the ATI Radeon E4690 Mobile PCI Express module (MXM) for the graphics-intensive embedded systems at the Digitimes Tech Forum (DTF) 2010 in Taiwan.

Intel has introduced its new Intel Core family of processors for notebooks, desktops and embedded devices.

VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices.

Applied Micro Circuits Corporation (AppliedMicro, formerly AMCC) and Taiwan Semiconductor Manufacturing Company (TSMC) have jointly announced a collaboration enabling AppliedMicro's...