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NEWS TAGGED EUV
Wednesday 2 December 2020
TSMC to roll out 3nm Plus process in 2023
TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.
Thursday 26 November 2020
Korea memory chip output value to decrease 9.5% in 4Q20, says Digitimes Research
The combined memory output value of South Korean vendors Samsung Electronics and SK Hynix are expected to register a sequential decrease of 9.5% in fourth-quarter 2020 after falling...
Thursday 19 November 2020
Entegris licenses RSP and EUV technology to Gudeng
Entegris has announced it has agreed to settle patent litigation and disputes with Gudeng Precision related to reticle pod technology for both conventional and EUV lithography. The...
Friday 13 November 2020
Highlights of the day: TSMC has strong demand for EUV tools
TSMC has been fast expanding advanced node manufacturing capacity, requiring strong support from ASML for EUV litho equipment. The world's top pure-play foundry house has already...
Friday 13 November 2020
TSMC places big EUV equipment orders for 2021
TSMC has already placed EUV lithography equipment orders with ASML for 2021 for at least 13 sets, according to industry sources.
Friday 30 October 2020
Samsung expects profit to decline in 4Q20
Samsung Electronics expects profit to decline in the fourth quarter amid weakening memory chip demand from server customers and intensifying competition in mobile phones and consumer...
Tuesday 27 October 2020
Samsung reportedly to accelerate advanced foundry technology development
Samsung Electronics is reportedly looking to advance its partnership with EUV fab tool vendor ASML, aiming to accelerate the development of its advanced 5nm and 3nm foundry process...
Wednesday 7 October 2020
China semi industry development taking shape, says former Tsinghua Unigroup executive
The development of China's homegrown semiconductor industry is taking shape, according to Charles Kau, who has just resigned as executive VP of global operations for Tsinghua Unigr...
Wednesday 30 September 2020
China memory chipmakers could be next US trade ban target
With Semiconductor Manufacturing International (SMIC) at risk of being blacklisted by the US government, concerns are growing about whether China-based memory chipmakers ChangXin...
Tuesday 29 September 2020
Providing diverse and complete solutions, TEL continues to break through advanced semiconductor process technology
In addition to process technology which enhances the performance of semiconductor devices by scaling, 3D and heterogeneous integration has led to the development of various new structures...
Monday 28 September 2020
TSMC EUV litho equipment purchases to top 50 sets
TSMC is expected to cumulatively purchase about 55 sets of EUV lithography equipment by the end of 2021, as the foundry is stepping up its EUV process manufacturing development, according...
Friday 25 September 2020
TSMC to ramp up 3nm chip production starting 2H22
TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
Thursday 24 September 2020
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...
Tuesday 8 September 2020
Possible SMIC blacklisting may reshape pure-play foundry landscape
The potential blacklisting of SMIC, China's largest pure-play foundry, by the US government may shake up the second-tier pure-play foundry market segment.
Tuesday 1 September 2020
Samsung begins mass production of 16Gb LPDDR5 DRAM
Samsung Electronics has announced mass production of 16Gb LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology, at its second production line in Pyeongtaek.