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NEWS TAGGED EUV
Monday 24 August 2020
TSMC makes 1 billionth defect-free 7nm chip
TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.
Friday 21 August 2020
ASML opens EUV training center in Taiwan
ASML has unveild its Global EUV Training Center in Tainan, southern Taiwan to serve its customers in Asia.
Tuesday 18 August 2020
Samsung announces silicon-proven 3D IC technology
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Monday 17 August 2020
ASML to set up EUV tech training center in Taiwan
ASML has announced it will set up an EUV technology training center at Southern Taiwan Science Park (STSP), giving a boost to the EUV technology cluster headed by TSMC.
Tuesday 11 August 2020
TSMC fab toolmakers see July revenue increase on-year
TSMC's Taiwan-based fab tool suppliers, including Foxsemicon Integrated Technology, Grand Process Technology (GPTC) and Gudeng Precision Industrial, all saw their revenues for July...
Monday 3 August 2020
Silicon wafer materials and equipment suppliers see orders pull in from TSMC
With TSMC scaling up its 7nm and 5nm chip output, related silicon wafer materials and equipment suppliers have seen significant orders from the pure-play foundry and are ramping up...
Monday 3 August 2020
TSMC develops dry-clean technique for EUV mask
TSMC has developed what the company claims is the world's first environmental-friendly "dry-clean technique for EUV mask" to replace the traditional clean process.
Wednesday 29 July 2020
Gudeng posts profit growth in 2Q20
Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has disclosed net profits...
Monday 27 July 2020
TSMC EUV nodes to attract orders from Intel, sources say
Intel at its recent earnings call disclosed that its next-generation 7nm processors, including the company's first 7nm datacenter GPU design, would rely on external and internal process...
Wednesday 22 July 2020
KLA intros electron-beam defect inspection system
KLA has announced the eSL10 e-beam patterned-wafer defect inspection system, which is designed to accelerate time-to-market for high-performance logic and memory chips, including...
Monday 20 July 2020
SMIC faces hurdles catching up with TSMC
China's state-backed SMIC has stepped up the development of its FinFET process technology, disclosing plans to roll out its FinFET N+1 and N+2 processes without implementing EUV li...
Monday 20 July 2020
Taiwan fab toolmakers poised to gain from TSMC capex increment
Equipment suppliers in the TSMC Grand Alliance will see their revenues for the second half of 2020 receive a significant boost as the foundry has recently announced raising its capex...
Monday 20 July 2020
Samsung struggling to improve 5nm process yield, say sources
It remains to be seen whether unsatisfactory yield rates at Samsung Electronics' 5nm EUV process may affect the launch of Qualcomm's next-generation flagship 5G mobile chip series,...
Wednesday 15 July 2020
Suppliers look to new iPhones, TSMC EUV nodes for 2H20 growth
Taiwan-based suppliers engaged in the supply chains of Apple and TSMC may still be able to see their sales performance follow seasonal patterns in the third quarter - traditionally...
Wednesday 15 July 2020
Jumping on the EUV bandwagon: Q&A with Gudeng chairman Bill Chiu
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment standards after...