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NEWS TAGGED EUV
Tuesday 29 September 2020
Providing diverse and complete solutions, TEL continues to break through advanced semiconductor process technology
In addition to process technology which enhances the performance of semiconductor devices by scaling, 3D and heterogeneous integration has led to the development of various new structures...
Monday 28 September 2020
TSMC EUV litho equipment purchases to top 50 sets
TSMC is expected to cumulatively purchase about 55 sets of EUV lithography equipment by the end of 2021, as the foundry is stepping up its EUV process manufacturing development, according...
Friday 25 September 2020
TSMC to ramp up 3nm chip production starting 2H22
TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
Thursday 24 September 2020
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...
Tuesday 8 September 2020
Possible SMIC blacklisting may reshape pure-play foundry landscape
The potential blacklisting of SMIC, China's largest pure-play foundry, by the US government may shake up the second-tier pure-play foundry market segment.
Tuesday 1 September 2020
Samsung begins mass production of 16Gb LPDDR5 DRAM
Samsung Electronics has announced mass production of 16Gb LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology, at its second production line in Pyeongtaek.
Monday 24 August 2020
TSMC makes 1 billionth defect-free 7nm chip
TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.
Friday 21 August 2020
ASML opens EUV training center in Taiwan
ASML has unveild its Global EUV Training Center in Tainan, southern Taiwan to serve its customers in Asia.
Tuesday 18 August 2020
Samsung announces silicon-proven 3D IC technology
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Monday 17 August 2020
ASML to set up EUV tech training center in Taiwan
ASML has announced it will set up an EUV technology training center at Southern Taiwan Science Park (STSP), giving a boost to the EUV technology cluster headed by TSMC.
Tuesday 11 August 2020
TSMC fab toolmakers see July revenue increase on-year
TSMC's Taiwan-based fab tool suppliers, including Foxsemicon Integrated Technology, Grand Process Technology (GPTC) and Gudeng Precision Industrial, all saw their revenues for July...
Monday 3 August 2020
Silicon wafer materials and equipment suppliers see orders pull in from TSMC
With TSMC scaling up its 7nm and 5nm chip output, related silicon wafer materials and equipment suppliers have seen significant orders from the pure-play foundry and are ramping up...
Monday 3 August 2020
TSMC develops dry-clean technique for EUV mask
TSMC has developed what the company claims is the world's first environmental-friendly "dry-clean technique for EUV mask" to replace the traditional clean process.
Wednesday 29 July 2020
Gudeng posts profit growth in 2Q20
Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has disclosed net profits...
Monday 27 July 2020
TSMC EUV nodes to attract orders from Intel, sources say
Intel at its recent earnings call disclosed that its next-generation 7nm processors, including the company's first 7nm datacenter GPU design, would rely on external and internal process...
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