Following the announcement of a technology transfer agreement with Tata Electronics—set to establish India's first commercial wafer fab in three decades—Powerchip Semiconductor...

Tokyo Electron, a leading semiconductor equipment provider from Japan, will supply chipmaking tools to Tata Electronics, which is constructing India's first wafer fab. Meanwhile,...

In a key move to advance its assembly, testing, marking, and packaging (ATMP) facilities in Vemagal, Karnataka, and Jagiroad, Assam, Tata Electronics has signed an MoU with ASMPT...

Kyushu's anticipation for the economic impact brought about by TSMC continues to grow.

According to industry sources, TSMC plans to launch its first high-NA EUV lithography equipment at its fab site in Hsinchu, northern Taiwan, by the end of September, a quarter earlier...

India-based RIR Power Electronics is setting up India's silicon carbide (SiC) manufacturing facility in Odisha, as the country is looking to expand incentive schemes beyond logical...

As Semicon India 2024 approaches, Tower Semiconductor and the Adani Group have announced a partnership to establish a wafer fab in Maharashtra, India. This strategic collaboration...

In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...

Six months ago, Intel CEO Pat Gelsinger introduced an ambitious "moonshot" initiative to match semiconductor manufacturing capacities in Europe and the US with those in Asia by 2030...

Previously, Samsung Electronics reportedly decided to suspend the construction of its Phase 2 wafer foundry production line at the Pyeongtaek P4 fab.

Semiconductor Manufacturing International Corporation (SMIC), China's leading foundry, is significantly expanding its production capacity with four new 12-inch wafer fabs in Beijing,...

Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...

Hua Hong Group, one of China's two major semiconductor foundries, trails behind Chinese industry leader SMIC in terms of both capacity and market share, holding a global market share...

Dresden officially welcomed the construction of a new wafer fab by TSMC with a groundbreaking ceremony on August 20.

The scope of the US Chips Act appears to have exceeded that of the China Integrated Circuit Industry Investment Fund II (Big Fund II), but the American government's goal of reshoring...