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NEWS TAGGED FC-CSP
Wednesday 26 January 2022
With high revenue in 1Q22, PTI considers deals with Micron, SK Hynix
Backend house Powertech Technology (PTI) expects to post a double-digit on-year revenue surge in the first quarter of 2022 after posting record business results for 2021, and is optimistic...
Friday 29 October 2021
IC backend quotes to stay favorable to OSATs in 2022, says ASE
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
Thursday 28 October 2021
Backend firms gearing up to embrace chip demand boom for 5G Android phones
OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured...
Tuesday 3 August 2021
OSATs in talks with substrate suppliers about 2023 orders
Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Monday 14 December 2020
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Friday 6 November 2020
ASE, Win Semi cut into supply chain for new Qualcomm chips
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
Monday 26 October 2020
Taiwan makers urged to build high-end IC substrate ecosystem
A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
Monday 26 October 2020
PTI eyes new logic IC orders from MediaTek, Novatek, Realtek
Memory backend specialist Powertech Technology (PTI) is aggressively foraying into new logic IC segments such as TV SoCs and handset APs in a bid to offset loss of orders expected...
Wednesday 10 July 2019
Order visibility for IC packaging materials clear throughout 3Q19
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
Monday 22 April 2019
Backend houses in FC-CSP price war
With the crypto mining fever subsiding, many Taiwan backend houses have seen their FC-CSP machines dedicated to packaging mining ASICs stay idle since late 2018, forcing them into...
Friday 15 February 2019
Huawei eyeing smartphone market crown in 2019
Huawei has set ambitious goals for its smartphone operations in 2019, aiming to unseat Samsung as the world's largest smartphone vendor, according to industry sources.
Thursday 28 October 2010
Unimicron 3Q10 gross margin slips on higher costs, strong NT dollar
PCB supplier Unimicron Technology has announced third-quarter consolidated revenues of NT$17.45 billion (US$568 million), up 5% sequentially. But gross margin for the quarter slid...
Wednesday 20 January 2010
IC substrate maker Kinsus sees growing demand from handset segment
Kinsus Interconnect Technology expects first-quarter revenues to have only a slight drop sequentially despite fewer working days, as demand from handset chip customers has picked...
Thursday 13 November 2008
Semco becomes top-two FC-CSP substrate supplier
Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...