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NEWS TAGGED FC-CSP
Tuesday 29 July 2008
NPC to relocate wirebond capacity to China
Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order...
Monday 28 July 2008
Kinsus gross margin hits record-low in 2Q; expects rebound in 3Q
Despite recording a record-low gross margin in the second quarter of 2008, IC substrate supplier Kinsus Interconnect Technology expects a recovery for flip-chip chip-scale packaging...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research