Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...

Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order...

Despite recording a record-low gross margin in the second quarter of 2008, IC substrate supplier Kinsus Interconnect Technology expects a recovery for flip-chip chip-scale packaging...