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NEWS TAGGED FC-CSP
Tuesday 29 July 2008
NPC to relocate wirebond capacity to China
Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order...
Monday 28 July 2008
Kinsus gross margin hits record-low in 2Q; expects rebound in 3Q
Despite recording a record-low gross margin in the second quarter of 2008, IC substrate supplier Kinsus Interconnect Technology expects a recovery for flip-chip chip-scale packaging...