Compound semiconductors including third-generation ones GaN and SiC will play a crucial part in the emerging 6G, car-use or mobile LiDAR, and biometrics device applications, according...
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
As the application market for third-generation semiconductors GaN and SiC devices is on track for rapid expansion, international IDMs including Cree, Infineon, SMT Microelectronics...
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has held a beam-raising ceremony for its...
Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...
The output value of Taiwan's compound semiconductor industry grew 26.4% on year to NT$36 billion (US$1.28 billion) in the first half of 2021, according to statistics compiled by the...
TSMC is gearing up for a bigger presence in the automotive IC foundry market segment, with its newly-developed N5A process set to be available in the third quarter of 2022, according...
Huawei will set up its first wafer fab in Wuhan, China's Hubei province, with production expected to kick off in phases starting 2022, according to industry sources.
China brand vendors such as Xiaomi and Anker have rolled out their GaN-based fast charging devices for consumer technology products, which will be stimulating demand for GaN-on-Si...
Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...
Nexperia has announced a comprehensive partnership covering gallium nitride (GaN) power semiconductor devices with United Automotive Electronic Systems (UAES). The program will focus...
GaAs foundry Win Semiconductors expects sales of power amplifiers (PA) for 5G handsets to climb to 30-40% of its total PA revenues in 2021, with shipments for Wi-Fi 6E applications...
Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
Unikorn Semiconductor, a provider of foundry services for III-V compound semiconductor components, will extend production of GaN-on-Si chips for fast charging devices from 65W chips...
