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Wednesday 24 July 2019
Taiwan IC testing service providers see growing 5G orders
Taiwan-based IC testing service providers including Integrated Service Technology (IST), Materials Analysis Technology (MA-Tek) and Sporton International, have seen customers' demand...
Tuesday 18 June 2019
IC materials analyzers see robust demand from 5G, AIoT, Wi-Fi 6 applications
Taiwan's dedicated semiconductor materials and devices analysis, testing and verification labs, including Integrated Service Technology, (iST), Materials Aanalysis Technology (MA-tek)...
Monday 17 June 2019
VIS lands new clients amid trade war, but conservative about 2H19
Vanguard International Semiconductor (VIS) is optimistic about longer-term business prospects as it has enjoyed an increase of new clients amid the US-China trade war, although prospects...
Monday 3 June 2019
Xintec cautious about 2019
Niche-market IC packaging house Xintec continues to expand its offerings and client portfolio in its target markets, and remains focused on wafer-level packaging, according to company...
Friday 17 May 2019
Huawei tightening ties with Taiwan IC supply chain
China's largest telecom equipment maker Huawei and its chipmaking arm HiSilicon are ambitiously proceeding with their vertical and horizontal deployments in diverse chip solutions...
Wednesday 3 April 2019
MA-tek revving up organic IC materials analysis to tap 5G opportunities
Taiwan's Materials Analysis Technology (MA-tek), after gaining a solid presence in the silicon-based materials analysis business, is aggressively venturing into the analysis market...
Friday 29 March 2019
Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales
Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new 12-inch wafer plant...
Friday 8 March 2019
IDMs revving up production of GaN, SiC devices for 5G applications
High-performance RF components and power devices made of third-generation compound semiconductor materials with wide band-gap, such as GaN and SiC, are expected to be increasingly...
Wednesday 6 March 2019
Win Semi lands orders for satellite communications components
Taiwan's leading compound semiconductor foundry Win Semiconductors has reportedly tapped into the satellite communications supply chains of US aerospace firms by providing mmWave...
Monday 7 January 2019
Transcom, IntelliEPI taps GaAs, GaSb devices into military sector
Taiwan-based compound semiconductor components suppliers including Transcom and Intelligent Epitaxy Technology (IntelliEPI) are aggressively venturing their GaAs, GaN and GaSb devices...
Thursday 6 December 2018
Business of 5G seen to bring only symbolic benefits for GaAs firms in 2019
Applications of 5G will generate only symbolic rather than substantive economic benefits to suppliers of wireless compound semiconductor components devices such as radio frequency...
Wednesday 5 December 2018
Infineon CoolGaN solutions adopted for data center applications
Infineon Technologies has recently released its CoolGaN devices, which have attracted orders from Eltek, a Delta Electronics Group company, for datacenter and server applications,...
Friday 2 November 2018
IDMs keen to develop GaN devices for new application markets
Leading international IDMs including Texas Instruments (TI), Infineon and Rohm are aggressively developing GaN (gallium nitride) power devices to meet the growing demand for high...
Monday 1 October 2018
IDMs keen to develop advanced power devices with SiC, GaN
International IDMs including STMicrolectronics, Infineon and TI are aggressively developing power devices using third-generation compound semiconductor materials silicon carbide (SiC)...
Monday 3 September 2018
Wafer thinning needed to boost silicon power devices performance
Wafer thinning technology is expected to play an increasingly crucial role in Taiwan's power discrete device supply chain, as the technology can work well to lower resistance and...