News tagged glass substrate at DIGITIMES

NEWS TAGGED GLASS SUBSTRATE

Friday 6 November 2026

Nvidia reportedly buys glass substrate samples from Korea's JNTC

South Korea's JNTC has joined Nvidia's purchasing supplier list and is supplying paid samples of through-glass via (TGV) substrates, including 2mm-thick glass cores, The Elec...

Tuesday 20 October 2026

TPK targets 2028 TGV mass production with NT$6 billion investment

TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...

Tuesday 20 October 2026

MediaTek's Google TPU v9 faces potential delay over glass substrate yields, but 2026 orders remain strong

Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...

Friday 16 October 2026

LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones

LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...

Wednesday 14 October 2026

BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders

China's BOE has spent approximately six months trying to resolve recurring glass substrate breakage at its Gen 8.6 OLED plant in Chengdu, raising...

Monday 12 October 2026

LG Display unveils maskless OLED technology, targeting more efficient IT displays

LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing...

Saturday 10 October 2026

Semco moves glass substrates to package-level testing

Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...

Saturday 10 October 2026

JNTC bets US$259 million on glass substrates ahead of 2028 ramp

South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...

Wednesday 7 October 2026

Samsung tests Chemtronics glass interposer samples

South Korean materials company Chemtronics has delivered glass interposer samples to Samsung Electronics, with customer evaluation now underway, according to Korean business outlet...

Tuesday 6 October 2026

China's glass substrate ramp-up outpaces South Korea with WG Tech targeting 1M sqm

China's WG Tech has reportedly begun the second phase of investment in its through-glass via (TGV) glass substrate production line, with total future capacity projected to reach 1...

Wednesday 23 September 2026

SKC raises Absolics stake to 82% as glass substrates remain in testing

SKC is increasing its investment in its US glass substrate subsidiary Absolics, raising its stake to more than 82%, as the South Korean materials group commits more capital to a business...

Friday 18 September 2026

Corning to raise display glass substrate prices 15% from 4Q26

Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026,...

Wednesday 16 September 2026

Glass substrates, TGV set to reshape 2027 advanced packaging race

As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...

Thursday 10 September 2026

AUO matching glass substrate size stokes TSMC collab speculation

AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.

Thursday 10 September 2026

Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

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