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Tuesday 24 December 2024
Innolux charts course into FOPLP amid market headwinds
Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel"...
Tuesday 24 December 2024
Lam introduces collaborative robot to boost fab efficiency
Lam Research has introduced Dextro, which the company claims is the semiconductor industry's first collaborative robot (cobot) designed to optimize critical maintenance tasks on wafer...
Tuesday 24 December 2024
Taiwan's ITRI and MCU maker Generalplus showcase 3D IC packaging technology for smart healthcare
The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection...
Tuesday 24 December 2024
China's SiC expansion reshapes global supply chain
The year 2024 marks a pivotal shift in the silicon carbide (SiC) industry, as unprecedented production increases by Chinese manufacturers transform the global supply chain. This critical...
Monday 23 December 2024
TSMC's wafer manufacturing 2.0 reshapes advanced packaging market
TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...
Monday 23 December 2024
Innolux seeks assistance to advance FOPLP technology
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
Monday 23 December 2024
Innolux expands semiconductor footprint with FOPLP and silicon photonics
Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out panel-level packaging (FOPLP) to include silicon photonics...
Monday 23 December 2024
TSMC capacity expansion powers supply chain for 2025 boom
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
Monday 23 December 2024
3DIC and packaging drive AI chip innovation at SEMICON Japan 2024
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations...
Monday 23 December 2024
Gree's 6-year chip success: SiC factory launches with 200 million units shipped, fully self-funded
On December 16, Gree Electric Chairwoman Ming-zhu Dong told Sina Finance CEO Qing-xu Deng, "Gree's chips have succeeded. We have achieved everything from independent research and...
Monday 23 December 2024
TSMC soars while Rapidus, SMIC stumble on state crutches
The global wafer foundry landscape is undergoing a dramatic transformation. TSMC maintains its dominance in advanced nodes below 7 nanometers, while competitors Samsung and Intel...
Monday 23 December 2024
Samsung, Texas Instruments Finalize Chips Act Awards Deals
Samsung Electronics Co. and Texas Instruments Inc. completed final agreements to get billions of dollars of government support for new semiconductor plants in
the US, cementing...
Monday 23 December 2024
Weekly news roundup: Chinese chip crackdown intensifies as global semiconductor landscape shifts
Semiconductor Week in Review (Dec 15 - 21) :
Monday 23 December 2024
Synaptics to assemble chips in India by 2027 as part of diversification strategy
US chip designer Synaptics Inc. aims to assemble and package at least 10% of its chips in India by 2027 to diversify its supply chain and reduce dependency on China.
Friday 20 December 2024
Merck to set up new advanced materials center in Japan
Merck has announced plans to invest over EUR70 million(US$72.53 million) to construct a new advanced materials development center (AMDC) at its Shizuoka site in Japan. This latest...