Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
One of China's most prominent chip gear makers is suing the Pentagon for linking it to the People's Liberation Army, seeking to get off a blacklist that bars business with American...
Bloomberg previously reported that China's Ministry of Industry and Information Technology (MIIT) has instructed EV companies like BYD and Geely to increase the procurement of domestic...
L&T Semiconductor Technologies, an Indian startup set up less than a year ago, expects to begin developing chips for six automobile companies and eventually venture into the chipmaking...
In his 42 months as CEO of Intel, Pat Gelsinger recently issued an internal memo announcing layoffs, sharply criticizing Intel's deep-seated issues. He stated that Intel's "costs...
Daxin Materials, which provides specialty chemicals for semiconductor, display, and key raw materials, has developed chipmaking materials supporting advanced 2nm manufacturing processes...
China's smartphone application processor (AP) shipments returned to the traditional off-season pattern in the second quarter of 2024, with a slight quarter-on-quarter increase of...
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...
Applied Materials reported growth across all segments, driven by AI-fueled demand and advancements in semiconductors, including gate-all-around (GAA), high-bandwidth memory, and advanced...
TSMC has acquired Innolux's 5.5G LCD fab in Tainan, southern Taiwan, for NT$17.14 billion (US$530.8 million). The acquisition price is less than what the market had anticipated.
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
