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Wednesday 27 March 2024
Nikon sees Chinese EV industry as a key part of its lithography revival
In the fiercely competitive realm of the global lithography market dominated by ASML, Nikon is making strategic inroads. The renowned Japanese company is now supplying lithography...
Wednesday 27 March 2024
IC packaging materials supplier CWE obtains NT$3 billion syndicated loan
Chang Wah Electromaterials (CWE) has signed a five-year syndicated loan agreement for NT$3 billion (US$94 million) with 12 local banks in Taiwan, according to the semiconductor materials...
Wednesday 27 March 2024
Japan-based suppliers capitalize on emerging glass substrate as chipmakers embrace advanced packaging
As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...
Wednesday 27 March 2024
South Korean Congress may fail to approve its Chips Act amendment before deadline
Tax incentives promised for South Korean semiconductor companies by its version of the Chips Act may fall through the fingers.
Wednesday 27 March 2024
Sporton bets on AI device sales for 2H24 growth
Inspection and certification lab Sporton International anticipates that orders for AI device applications will drive Q224 revenue growth.
Wednesday 27 March 2024
Major tech CEOs visit China in March, Nvidia and Intel steal spotlight
In March, CEOs from 11 global technology companies were active in the US and China, with their focus squarely on AI, chips, and the Chinese market.
Wednesday 27 March 2024
Research Insight: Intel obtains subsidies but faces challenges
Vying for government subsidies would be the easiest assignment for Intel when it comes to expanding its foundry business, DIGITIMES Research believes.
Tuesday 26 March 2024
Liteon+ aims to boost startup innovation
Liteon Technology recently co-hosted its first Demo Day for its Liteon+ startup platform. The company presented the performance of five startups including PackAge+ and Elephantech.
Tuesday 26 March 2024
ST, Samsung partner on first 18nm FD-SOI MCU for automotive market
ST wants a stronger presence in the MCU market.
Tuesday 26 March 2024
Samsung to build fully automated fabs with Nvidia Omniverse platform
Samsung is building a virtual fab
Tuesday 26 March 2024
Toppan relocates CIS components production from Japan to China
Japan-based Toppan Holdings has shifted the production of components for CMOS image sensor components (CIS) from Japan to China, increasing local production by 40% as Beijing seeks...
Tuesday 26 March 2024
Huawei chipset spec leak shows chips made using SMIC 5nm process
Huawei Central website quoted a chipset spec sheet leaked onto the Internet, highlighting that the chip is manufactured using the SMIC 5nm process.
Tuesday 26 March 2024
Former TSMC director: China will form its semiconductor system, but hard to compete with others
Retired former TSMC R&D director Konrad Young said China's semiconductor industry will eventually become an independent ecosystem and develop its systems under the US sanctions...
Tuesday 26 March 2024
Foxconn subsidiary and MediaTek team up for co-packaged optics devices
Foxconn Interconnect Technology (FIT), a subsidiary of Hon Hai Technology Group (Foxconn), has partnered with MediaTek to co-develop a groundbreaking 51.2T solution incorporating...
Tuesday 26 March 2024
India on right path in developing semiconductor ecosystem, says experts
Despite initial challenges, industry leaders and experts are optimistic that India is on a trajectory that aligns with developing a robust indigenous semiconductor industry.