中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
PnP Summit
TSMC
AI Search
NTN Convergence
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
NEWS TAGGED IDM AND FABLESS RESEARCH
Saturday 15 March 2025
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
On March 12, 2025, Intel appointed semiconductor industry veteran Lip-Bu Tan as its new CEO, a move that has garnered significant industry attention. DIGITIMES analyst Eric Chen notes...
Tuesday 24 December 2024
Global investment plans of Japanese IDMs
Introduction
Tuesday 8 October 2024
CSP in-house development of ASIC accelerators
Introduction
Wednesday 25 September 2024
Automotive CIS tech development, 2024
Introduction
Friday 5 July 2024
Arm AI applications at Computex 2024
Introduction
Thursday 20 June 2024
Server AI accelerator market and technology
Introduction
Thursday 16 May 2024
Wi-Fi 7 applications and tech development
Introduction
Thursday 21 March 2024
Development of NearLink in China
Introduction
Tuesday 12 March 2024
Global semiconductor industry, 2024
Introduction
Friday 24 November 2023
Global DRAM and NAND flash industry
Introduction
Monday 6 November 2023
China smartphone AP shipments, 3Q 2023
Introduction
Tuesday 24 October 2023
HPC chip industry, 2H 2023
Introduction
Wednesday 11 October 2023
China semiconductor industry status
Introduction
Thursday 21 September 2023
China smartphone AP shipments, 2Q 2023
Introduction
Friday 5 May 2023
China smartphone AP shipments, 1Q 2023
Introduction
1/2
pages
1
2
BIZ FOCUS
Apr 28, 08:00
AI anti-fraud solution wins virtual asset security hackathon
Monday 27 April 2026
SK hynix receives 2026 IEEE Corporate Innovation Award
Monday 27 April 2026
Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
Friday 24 April 2026
NewPower Named HPE 2026 Partner of the Year
MOST-READ
7 DAYS NEWS
Agibot claims 100% success rate in factory deployment as humanoid race shifts to real-world validation
TSMC's COUPE push puts Samsung's silicon photonics ambitions under pressure
SK Hynix speeds Yongin fab buildout as memory crunch fuels capacity race
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
AMD's 2nm defection to Samsung dents TSMC's AI grip
Kawasaki opens Silicon Valley physical AI center, deepening Nvidia ties
Embedded substrates draw AI chip interest as packaging turns strategic
India roundup: India accelerates chip ambitions, but ecosystem gaps remain a key challenge
Samsung's China exit shows Korean brands under pressure
Tech Forum 2026: AI data centers turn to on-site power amid grid constraints
Full list
RESEARCH INSIGHTS
Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first