The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
Micron Technology has announced the release of the Micron 9550 NVMe SSD, which the company claims is the world's fastest data center SSD and an industry leader in AI workload performance...
In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...
Amid a plan by India to invest heavily in GPUs to advance its national AI initiatives, Intel is optimistic about the potential in India's data center sector and is also eager to secure...
TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.
Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...
In March and April 2024, Intel and TSMC received substantial subsidies of US$8.5 billion and US$6.6 billion respectively for building plants in the US under the CHIPS and Science...
Samsung Electronics is aggressively targeting Compute Express Link (CXL), a highly anticipated next-generation memory technology. The CXL market is expected to take off in the second...
AMD has postponed the Ryzen 9000 series launch due to quality issues found in initial production units. The company is replacing affected chips and has confirmed a packaging, not...
With Taiwan Semiconductor Manufacturing Company (TSMC) proposing its Foundry 2.0 model, some industry experts compare it with Intel's IDM 2.0. However, the challenges Intel faces...
AI startup Tenstorrent, led by chip industry veteran Jim Keller as CEO, recently announced a new generation of AI hardware featuring the Wormhole Tensix processor equipped with RISC-V...
Intel has confirmed that part of its European investment project has been shelved due to economic reasons, highlighting the chipmaker's challenges in its foundry business, which relies...
With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
For enterprises whose operations span a diverse range of outdoor working environments, rugged IT solutions that combine purpose-built hardware with industry-specific software can...
