Samsung beware: As Intel Foundry (IF) is now collaborating with TSMC to accomplish an advanced packaging mission to meet customer's needs, it is aiming for something bigger.
Collaboration with UMC is a significant step towards Intel becoming the world's second-largest foundry by 2030, according to Stuart Pann, SVP and GM of Intel Foundry.
The Arm Total Design ecosystem has attracted international heavyweight partners. Arm Taiwan president CK Tseng pointed out that the existing infrastructure is no longer sufficient...
Hon Hai Technology (Foxconn) is transitioning to a "solutions" provider rather than an electronics and semiconductor manufacturer. The firm said it is moving toward a "system foundry"...
At the first conference for its burgeoning foundry business, Intel restated its aim to provide five advanced process nodes in four years. The company also disclosed plans for more...
Despite delays in grants offered by the US government and weak demands for end products that hurt global semiconductor firms, US states are likely to benefit from the onshoring chip...
With Windows 12 delayed until 2025, according to supply chain rumors, Microsoft will instead focus on an AI-centric update to Windows 11 in mid-2024. During this year's Computex Taipei,...
After leaving Intel for 12 years, former Chief Technology Officer Pat Gelsinger returned in mid-February 2021 to take over as Intel's eighth CEO. However, compared to his tenure from...
The most advanced chip manufacturing process competition has already begun before mass production. Samsung Electronics reportedly secured a 2nm AI chip order from Japan-based startup...
Faraday Technology announced a collaboration with Arm and Intel to lead the development of a 64-core system-on-chip (SoC) based on Intel 18A technology.
TSMC has not placed orders for high-numerical aperture (High-NA) extreme ultraviolet (EUV) tools and is unlikely to use the technology in 2nm and 1.4nm (A14) process manufacturing,...