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Wednesday 20 August 2025
Why TSMC's CoWoS bottleneck could lock AI memory makers into Nvidia's orbit
The AI chip market is expected to stay under Nvidia's dominance in 2026, as Samsung Electronics, SK Hynix, and Micron battle to win sixth-generation high-bandwidth memory (HBM4) orders...
Wednesday 20 August 2025
Samsung's HBM3E supply to Nvidia loses strategic significance as focus shifts to HBM4 in 2026
Driven by the booming demand for artificial intelligence (AI) servers, high-bandwidth memory (HBM) has become a key factor reshaping the memory industry landscape. Micron recently...
Tuesday 19 August 2025
Samsung to challenge SK Hynix, Micron in Nvidia HBM supply after delays

Samsung Electronics is intensifying its bid to break into Nvidia's high-bandwidth memory (HBM) supply chain after lagging behind SK Hynix...

Tuesday 19 August 2025
SK Hynix signals slowing demand for TCB equipment, putting Hanmi at risk
The market for thermo-compression bonders, or TCB, has surged on the back of booming demand for AI. But signals out of South Korea now show signs of a slowdown. New orders in the...
Tuesday 19 August 2025
China's demand for AI chips and HBM equipment persists despite uncertainty over Nvidia H20 sales
China's semiconductor industry continues to expand capacity in mature process chips while strengthening self-production of AI chips, especially as the Chinese AI sector gained momentum...
Monday 18 August 2025
Phison profit drops on currency losses as NAND prices rise, CEO flags 2026 supply concerns
Phison Electronics reported a sharp decline in second-quarter 2025 profit as steep exchange-rate fluctuations eroded earnings, even as revenue climbed on stronger NAND pricing. Net...
Monday 18 August 2025
Strong demand for advanced nodes drives Topco's 1H25 revenue growth
Topco Scientific (TSC) stated during an earnings call on August 14, 2025, that current semiconductor market conditions are on par with the first quarter of 2025, adding that advanced...
Monday 18 August 2025
Commentary: Can Trump's stake-in steer Intel to recovery?
The Trump administration is in talks with Intel. The stakes? A direct equity investment in America's struggling chip giant.
Monday 18 August 2025
Section 232 investigations loom over Taiwan's key industries
Despite TSMC's US$165 billion investment in the US, Taiwan does not appear to have any special favor from the United States. Taiwan faces a higher reciprocal tariff compared to Japan...
Monday 18 August 2025
Huawei tests China's first HBM3 as CXMT accelerates expansion to counter supply squeeze
China's push for self-reliance in artificial intelligence (AI) semiconductors is running into fresh obstacles as Washington tightens controls on advanced memory. In response, ChangXin...
Monday 18 August 2025
Weekly news roundup: Apple's US$599 MacBook, China's HBM3 breakthrough, and TSMC 2nm leak update
Below are the top DIGITIMES Asia stories from August 11 to 17, 2025. Leading the headlines: Apple is preparing to launch a US$599 MacBook, with mass production of key components expected...
Monday 18 August 2025
SK Hynix labor dispute delays Nvidia HBM supply talks
A proposed bonus exceeding KRW100 million (US$72,000) per employee threatens to spark SK Hynix's first full-scale strike, with stalled high-bandwidth memory (HBM) supply talks heightening...
Monday 18 August 2025
Samsung DRAM market share sinks to decade low, consumer electronics cushion the blow
Samsung Electronics' global DRAM market share slipped to 32.7% in the first half of 2025, down 8.8% from 41.5% a year earlier, according to its August 14 semiannual earnings report,...
Sunday 17 August 2025
Future Science Prize 2025 honors Macronix International president Chih-Yuan Lu for semiconductor memory innovation
The 2025 Future Science Prize winners were announced, with Chih-Yuan Lu, president of Macronix International, receiving the Mathematics and Computer Science Prize for his contributions...
Saturday 16 August 2025
SK Hynix expands EUV in 1c DRAM, launches faster low-power chips for AI PCs

SK Hynix is stepping up its use of extreme ultraviolet (EUV) lithography in next-generation DRAM, increasing the number of EUV layers...