Intel's wafer manufacturing is facing significant challenges. Recent reports suggest that Broadcom estimates the Intel 18A process has not yet achieved mass production capability,...
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
The Biden administration plans to impose export controls on critical technologies including quantum computing and semiconductor goods, seeking to align key allies in a US-led push...
SEMICON Taiwan 2024 made its grand debut on the 4th. President of SK Hynix, Justin Kim, was invited to Taiwan and gave a keynote speech. He mentioned that to push AI technology towards...
Indian Prime Minister Narendra Modi visited Singapore, where he met with his counterpart and signed a series of Memorandums of Understanding (MoUs), including one focused on semiconductor...
The British semiconductor delegation, composed of 24 firms led by the UK Government's National Technology Adviser Dave Smith, has made its splash at SEMICON for the second year in...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
SEMICON Taiwan 2024 will feature more than 1,000 firms and up to 3,700 booths, including Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and SK Hynix.
SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...
SK Hynix has announced the successful development of the world's first sixth-generation 10nm-class DRAM (1c DRAM), surpassing industry leader Samsung Electronics in achieving mass...
Even though the third quarter is the traditional peak season for consumer electronics and other end-market applications, DRAM and NAND flash memory spot prices have decreased almost...
After Nvidia confirmed the on-schedule shipment of its latest Blackwell GPUs, high-bandwidth memory (HBM) providers, including SK Hynix and Samsung Electronics, expressed relief as...
August 28 marked the 100th day since Vice Chairman Young Hyun Jun was appointed as the new Head of the Device Solutions (DS) Division at Samsung Electronics. The South Korean industry's...
