News tagged Memory chips at DIGITIMES

NEWS TAGGED MEMORY CHIPS

Wednesday 4 June 2025

South Korea maintains HBM chip lead while China faces tech and trade hurdles

The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...

Wednesday 4 June 2025

Samsung executives visit Nvidia headquarters to secure HBM supply deal

Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...

Tuesday 3 June 2025

Samsung rides GDDR7 wave as Nvidia, AMD shift to comply with US export curbs

In response to intensified US export controls on advanced semiconductor shipments to China, major chipmakers Nvidia and AMD are reportedly adopting Samsung Electronics' GDDR7 graphics...

Tuesday 3 June 2025

SoftBank and Intel forge AI memory venture to challenge HBM dominance

Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The...

Tuesday 3 June 2025

Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay

Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...

Tuesday 3 June 2025

South Korean exports to the US and China fall sharply, but semiconductor sales hit record high

South Korea's exports to the US and China tumbled by more than 8% in May, reflecting growing pressures from global trade tensions and...

Tuesday 3 June 2025

South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...

Monday 2 June 2025

Nanya targets 4Q25 profitability as DDR4 rivals exit

Both AI and non-AI demands in the DRAM market are showing gradual recovery signs. Nanya estimates that it will clear all inventory before the third quarter of 2025. With yield improvements...

Monday 2 June 2025

Weekly news roundup: Huawei's 5nm PC, Wolfspeed's SiC crisis, and China's export chokehold

These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's...

Monday 2 June 2025

US plans wider China tech sanctions with subsidiary crackdown

The Trump administration plans to broaden restrictions on China's tech sector with new regulations to capture subsidiaries of companies under US curbs.

Friday 30 May 2025

Winbond ramps up in the DRAM shake-up, but trade fears loom

Amid growing uncertainty over global tariffs, Taiwanese memory chipmaker Winbond Electronics has seen a sudden surge in urgent orders during the second quarter of 2025, so much so...

Thursday 29 May 2025

Memory price surge supports IC distribution in 2Q25; supply and inventory require cautious management

Despite the global semiconductor market currently being affected by exchange rates, inflation, and US tariff policies, there are no clear signs of recovery in the end-user market...

Thursday 29 May 2025

Winbond braces for persistent NTD appreciation with AI and security focus

Winbond Electronics chairman Arthur Yu-Cheng Chiao predicted a long-term, possibly lifelong, appreciation of the New Taiwan dollar (NTD), citing changes in global interest rate dynamics...

Wednesday 28 May 2025

Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles

In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...

Wednesday 28 May 2025

Hanmi engineers return to SK Hynix after US$30.7 million TCB order resolves dispute

The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor...

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