PCL Technologies has secured a significant laser optical packaging order from Broadcom for its next-generation data center switch chips, signaling a milestone in the commercial rollout...

Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment...

Despite efforts, including the announcement of the Foundry 2.0 strategy to reduce its stated market share and address customer concerns, TSMC continues to dominate the pure-play foundry...

Samsung Electronics is weighing advanced semiconductor packaging and robotics as future growth drivers, with plans to discuss development strategies at its upcoming global strategic...

The CHIPS and Science Act has unlocked tens of billions in federal subsidies to reshore semiconductor manufacturing in the US. Yet, major projects by leading chipmakers are being slowed...