TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
The technology supply chain will gather for a series of exhibitions in the second half of 2025, including Taiwan's major PCB industry event, the TPCA Show, which will take place from...
Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module...
Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...
AI servers have become a key growth driver for the global printed circuit board (PCB) industry. Companies specializing in advanced packaging IC substrates and high-layer count, high-density...
Samsung Electro-Mechanics (Semco) has recently adjusted its IC substrate supply chain, appointing Mitsubishi and Resonac as the primary suppliers for key materials such as copper-clad...
Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in...
The artificial intelligence boom is driving sharp demand growth across the printed circuit board (PCB) materials chain, pushing both prices and volumes higher. Supply pressure is...
Zhen Ding Technology, the world's largest printed circuit board (PCB) manufacturer, announced that its Chinese subsidiary, Avary Holding, has approved a major investment plan for...
China's copper-clad laminate (CCL) producers, pressured by surging raw material costs and intensifying competition, have issued new price increase notices. Kingboard, Meizhou Weilibang...
In response to the global surge in large-scale AI computing power deployment, the usage and value of PCBs for AI servers have significantly increased. High-end copper-clad laminate...
Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...
Eternal Materials has reported revenue of NT$20.465 billion (approx. US$686 million) for the first half of 2025, down 5.2% year-over-year. Net profit attributable to the parent company...
