News tagged performance at DIGITIMES

NEWS TAGGED PERFORMANCE

Wednesday 5 November 2025

Micron's reported HBM4 delay could cede AI chip advantage to Samsung and SK Hynix

Micron Technology is reportedly redesigning its sixth-generation high-bandwidth memory (HBM4) after facing yield and performance issues, a setback that could push back supply until...

Wednesday 5 November 2025

Mediatek's subsidiary Airoha sees steady 3Q25 revenue, banks on Ethernet for growth

MediaTek's subsidiary Airoha reported a steady financial performance for the third quarter of 2025, with revenue reaching NT$5.63 billion (US$182.5 million), marking a 2% sequential...

Wednesday 5 November 2025

Musk highlights spec differences between Tesla AI5 chips made by TSMC and Samsung

Following Tesla's announcement that the AI5 chip will be produced by both Taiwan Semiconductor Manufacturing Company and Samsung Electronics, CEO Elon Musk explained the slight differences...

Wednesday 5 November 2025

Nintendo raises global sales forecast for Switch 2 following strong early performance

Nintendo has increased its global sales forecast for the Nintendo Switch 2 to 19 million units for fiscal 2025, marking a significant rise from its initial target of 15 million units...

Wednesday 5 November 2025

AMD hits record quarter as AI boom lifts all chips—except those bound for China

On November 4, AMD reported record results for the third quarter of 2025, driven by strong demand in the data center and client computing segments, which underscore the company's expanding...

Tuesday 4 November 2025

iPhone 17 sales exceed expectations to drive strong momentum in China for first quarter of FY26

Just two weeks after its launch, the iPhone 17 has provided strong momentum for Apple's fiscal 2025 fourth quarter, and the trend is expected to continue into the fiscal 2026 first...

Sunday 2 November 2025

Samsung's Exynos 2600 chips challenge Apple and Qualcomm in early benchmarks

Samsung Electronics' next-generation application processor, the Exynos 2600, appears poised to reclaim the spotlight in the high-end smartphone chip market, with early benchmark tests...

Friday 31 October 2025

China's CXMT cracks LPDDR5X speed barrier, posing a new test for Samsung and SK Hynix

Chinese memory maker ChangXin Memory Technologies (CXMT) has started mass production of LPDDR5X DRAM, marking a milestone in China's high-performance...

Friday 31 October 2025

TSMC's profit engines: Nvidia and Apple orders exceed 40% of revenue

TSMC has secured a record-breaking performance for 2025, with profits reaching NT$1.21 trillion (approx. US$39.4 billion) in the first three quarters, already surpassing full-year...

Friday 31 October 2025

SK Hynix dominates DRAM market in 3Q25 for third consecutive quarter

SK Hynix has taken the top spot of the global DRAM market for the third quarter of 2025 with a 35% market share, with Samsung just behind at 34%. This marks SK Hynix's third consecutive...

Friday 31 October 2025

UMC and Samsung present advanced packaging trends at APDC 2025

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...

Friday 31 October 2025

Apple posts record iPhone revenue despite supply constraints

Apple reported record iPhone revenue in its fiscal fourth quarter of 2024, achieving strong growth across iPhone, Mac, and Services segments despite ongoing supply shortages and rising...

Friday 31 October 2025

Amazon’s Q3 results reveal an AI-powered rebound in the cloud

Amazon reported better-than-expected third-quarter results, driven by accelerating growth in its cloud division and steady expansion across online retail and subscription services...

Thursday 30 October 2025

BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'

BIWIN announces that its Mini SSD has been recognized by TIME magazine as one of the Best Inventions of 2025, making it the only storage product worldwide to earn a spot...

Thursday 30 October 2025

Glass substrates edge toward prime time in PCB and chip packaging sector

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of...

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BIZ FOCUS

Jan 30, 12:05

Taiwan's Tron Future Tech to Debut Advanced Drone Interception and AI-Guided Anti-Armor Solutions at Singapore Airshow 2026

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook