Samsung Electronics (Samsung) is not only lagging in the HBM area, but its large lead in universal DRAM also shows signs of erosion, intensifying its internal sense of crisis. There...
A marked recovery in the gaming console supply chain is a sign that major brands are gearing up for the release of new devices, as evidenced by Sony's recent announcement of the PS5...
TSMC reported that August revenue decreased by 2.4% sequentially, but increased by 33% year-on-year. This would allow the pure-play foundry to meet its sales forecast for the third...
Large-size panel manufacturers, including AUO and Innolux, saw revenue growth in August. AUO, in particular, experienced a significant year-over-year revenue increase due to its merger...
As Apple prepares for its September 9 event, the industry is closely examining major suppliers' August results for insights into potential iPhone performance.
The president of Acer's Pan-Asia Pacific operations, Andrew Hou, pointed out that irresistible momentum in India and Indonesia, coupled with a rebound in business PC sales, has offset...
Hon Hai Technology Group (Foxconn) has disclosed that its revenue decreased sequentially by 4.2% in August. However, the company remains optimistic that its revenue will increase...
Qualcomm recently announced the expansion of the Snapdragon X series at the International Radio Exhibition Berlin (IFA Berlin 2024). Company CEO Cristiano Amon expressed confidence...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Artificial Intelligence (AI) is boosting rapid advancements in data center construction but with increasingly massive power demands. Research institutions predict that energy consumption...
At an event in Berlin on September 4, Intel introduced the Core Ultra 200V series processors, codenamed Lunar Lake. These new processors represent Intel's most efficient x86 architecture...
Despite Samsung Electronics' high expectations for the sales performance of its newly launched foldable smartphones, the Galaxy Z Fold 6 and Flip 6, intense competition from rivals...
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
