Recent years have seen shakeups in the traditional dichotomy of the processor landscape, in which Arm ruled the mobile market with its low power consumption and cost, while Intel...
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Both major SoC players, Qualcomm and MediaTek, have maintained an optimistic outlook since the beginning of the year. Apple, which initially projected lower sales for 2024, has sparked...
Samsung Electronics held its Galaxy Unpacked 2024 event on the evening of July 10 in Paris, France. The company introduced its new generation of foldable phones, the Galaxy Z Fold...
The PC sector has experienced an explosion of fresh ideas. New design concepts are being developed in addition to the popularity of AI PCs and the resurgence of Mini PCs, according...
MediaTek has shown remarkable resilience in the typically slow second quarter, with revenue steady compared to the previous three months. This performance suggests the company has...
Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance...
The US government's export ban on Nvidia's high-end AI chips has spurred efforts in China to produce domestic AI chips to meet the burgeoning demand in the country's AI sector.
TSMC recorded its financial performance in line with market expectations, with consolidated revenue in June at NT$207.869 billion, down 9.5% month-on-month but up 32.9% compared to...
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
The rapid development of large language models (LLMs) in China has led to various development bottlenecks for AI, including complex computing power management, high training and inference...
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Acer has received positive feedback from channel retailers for its AI PCs and expects its core operations in the second half of the year to outperform the first half. On July 8, the...
Taiwan's major outsourced semiconductor assembly and test (OSAT) service providers, including ASE Group, Powertech Technology, King Yuan Electronics (KYEC), and Sigurd Microelectronics,...
