CONNECT WITH US
NEWS TAGGED REFERENCE DESIGN
Monday 22 July 2024
Renesas intros power management solution for space-grade AMD SoC
Renesas Electronics has announced a complete space-ready reference design for the AMD Versal AI Edge XQRVE2302 Adaptive SoC.
Wednesday 18 October 2023
Pegatron steps up AI server deployment
Pegatron has stepped up its deployment in the AI server industry; at this year's OCP Global Summit, the company displayed product prototypes based on Nvidia's MGX modular reference...
Thursday 30 March 2023
Primax announced reference design partnership with Qualcomm in IoT gateway platform
Following Qualcomm's Embedded World 2023 announcement of new IoT processors designed to support four major operating systems, Primax is announcing a reference design partnership for...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Wednesday 10 November 2021
Compal Broadband expects Wi-Fi 6 to fuel replacement demand in Europe in 2022
Networking device provider Compal Broadband Networks (CBN) expects Wi-Fi 6 to trigger replacement demand in Europe starting 2022, and is therefore optimistic about its operations...
Thursday 20 August 2020
Renesas collaborates with Novatek on surveillance camera reference design
Renesas Electronics has introduced an ultra-high-definition (UHD) surveillance camera reference design developed in collaboration with Novatek Microelectronics and designed by Systemtec...
Monday 2 September 2019
Wintel developing standards for dual-screen notebooks, paving way for foldable-screen models
Intel and Microsoft have recently started establishing standards for dual-screen notebooks and are looking to extend the concept to cover foldable-screen notebooks, according to sources...
Friday 14 June 2019
X-Fab and Efabless announce Raven open-source RISC-V microcontroller
X-Fab Silicon Foundries, an analog/mixed-signal and specialty foundry, and crowd-sourcing IC platform partner Efabless, has announced the silicon availability of the Efabless RISC-V...
Friday 14 December 2018
Micron delivers monolithic 12Gb LPDDR4X DRAM for new MediaTek mobile SoC
Micron Technology has announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek's new Helio P90 smartphone platform reference...
Monday 29 October 2018
Altek offers Qualcomm Vision Intelligence-based surveillance camera reference design
Altek has introduced IPC603, an industrial surveillance camera reference design equipped with Qualcomm QCS603 SoC based on Qualcomm Vision Intelligence 300 Platform, for clients to...
Thursday 6 September 2018
Himax teams up with MediaTek, Megvii for 3D sensing solutions
Himax Technologies has announced it is teaming up with fellow IC design company MediaTek and Megvii, a China-based facial recognition start-up, to offer active stereo camera (ASC)...
Friday 13 April 2018
Altek offers reference design for Qualcomm
Digital camera ODM and imaging solution developer Altek has disclosed it has become a design partner for Qualcomm by offering reference designs for two latest Qualcomm SoCs.
Friday 12 January 2018
Spreadtrum and OmniVision introduce turnkey active stereo 3D camera reference design for smartphones
OmniVision Technologies and Spreadtrum Communications have jointly announced what they call the industry's first turnkey active stereo 3D camera reference design for smartphones....
Monday 24 April 2017
Specialty DRAM prices to rise, says AP Memory
AP Memory Technology has disclosed plans to raise its specialty DRAM (SRAM) prices. The memory design house also expressed optimism about demand for IoT applications that will offset...
Thursday 12 January 2017
Macronix memory incorporated in new Qualcomm LTE IoT chipset reference design
Macronix International's NAND MCP memory solution has been adopted and incorporated by Qualcomm as a part of the reference design for a LTE Cat. M1/NB-1 chipset, the MDM9206 modem,...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research