GlobalWafers, a subsidiary of solar wafer maker Sino-American Silicon Products (SAS), plans to more than double production capacity for third-generation semiconductors in 2022, according...
The wide bandgap (WBG) features of third-generation semiconductors make them particularly suitable for recharging and radio frequency (RF) applications, as silicon carbide (SiC) has...
Taiwan-based chipmakers, led by foundry TSMC and silicon wafer supplier GlobalWafers, are gearing up to tap into the market for gallium nitride (GaN), silicon carbide (SiC) and other...
Taiwan's Ministry of Science and Technology (MOST) is seeking proposals for its massive next-generation compound semiconductors prospective research and development project to explore...
Taiwan-based Episil, a foundry specializing in SiC power devices, returned to profitability in the first three quarters of 2021 from losses a year ago.
China has been aggressively developing its domestic third-generation semiconductor supply chain with government subsidies, which Taiwan-based makers regard as unfair competition challenging...
Third-generation gallium nitride (GaN) and silicon carbide (SiC) semiconductors are competing for use in power devices in future cars. While SiC has taken the lead thanks to Tesla,...
As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide)...
Onsemi, a supplier of intelligent power and sensing technologies, and GT Advanced Technologies (GTAT), a producer of silicon carbide (SiC), have announced that they have entered into...
For years, the business of Hana Microelectronics, the leading EMS provider in the Southeast Asia region, took off as orders divert from, to, or within China. Its business in China...
Compound semiconductors will become a key industry sector reaching a national strategic level in importance, as they will be badly needed to power many critical technological applications...
More China-based companies are looking to follow in the footsteps of BYD, developing IGBT and SiC-base power modules for electric vehicles (EV) in-house, according to industry sources...
Rohm will inject a total of JPY400 billion (US$3.64 billion) into its expansion through 2025, the Japan-based chip vendor disclosed in its mid-term management plan.
Taiwan has lagged behind world leaders by 20-30 years in the development of third-generation semiconductor materials including silicon carbide (SiC) and must use more collective forces...
