A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
Samsung Electronics is reportedly expanding its artificial intelligence (AI) chip design research organization in Silicon Valley to challenge Nvidia, the current leader in the AI...
The National Development Council (NDC) has just revealed a draft implementation package for the "Taoyuan-Hsinchu-Miaoli Silicon Valley Promotion Plan," proposed by President-elect...
Samsung Electronics has set up a new memory research and development (R&D) organization to advance 3D DRAM technologies and secure competitiveness through technology differenti...
Young Sohn, Harman International's chairman, joined Samsung Electronics in 2012 as the corporate president. He led the Samsung Strategy Innovation Center (SSIC) and has been critical...
A generative artificial intelligence startup targeting the Indian market raised $41 million in fresh funding, the largest such round by an early-stage AI contender in the country.
Rapidus, the advanced-node Japanese foundry service provider targeting cutting-edge processes at 2nm and below, revealed at a business luncheon participated by industry leaders that...
Since its inception in 2003, the Taiwanese-American Industrial Technological Association Silicon Valley (TAITA-SV) has firmly stood as a pivotal conduit for technological industry...
The "Cross-Strait +1" supply chain layout is quietly taking shape. For the semiconductor packaging and testing industry that emphasizes capacity and labor-intensive processes, the...
Korea's LG Group has been actively investing in startups related to battery, bio-med, clean technology, and IT components. Its venture capital subsidiary, LG Technology Ventures (LGTV)...
Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...
Applied Materials has announced its intention to establish a collaborative engineering center in Bangalore, India that will focus on the development and commercialization of semiconductor...
US-based Applied Materials will spend US$4 billion and leverage the subsidies provided by the US government to build an R&D center in Silicon Valley to strengthen the collaboration...
Former Apple Vice President Doug Beck was sworn in on May 9 as the newest director of Defense Innovation Unit (DIU) – an organization under the US Department of Defense dedicated...
