Five big acquisition announcements and more than a dozen smaller deals in 2020 pushed the total value of M&A agreements in the year to an all-time high of US$118 billion, surpassing...
DRAM contract market prices have risen 5-10% in the first quarter of 2021, and will continue their rally in the second quarter, according to sources at memory module makers.
IC Insights has forecast that China-produced ICs will represent only 19.4% of the country's IC market in 2025, a fraction of the country's "Made in China 2025" goal of 70%.
Time of flight (ToF) 3D sensors are emerging rapidly for massive consumer applications, prompting major semiconductor and optoelectronics players to join the supply chain and accelerating...
Samsung Electronics has kicked off volume production of 16Gb LPDDR5 chips using EUV-based 1znm process technology at its Pyeongtaek fab, while SK Hynix plans to install EUV exposure...
Winbond Electronics is constructing a new 12-inch wafer fab in Kaohsiung, southern Taiwan, which is scheduled to come online in the first half of 2022, according to the specialty...
The market for NAND flash memory remains oversupplied, but shortages of flash device controllers and passive components have constrained the supply of SSD and other related peripherals,...
China's IC foundry industry will register another growth in output next year, driven by the country's efforts in boosting its IC self-sufficiency, as well as international chipmakers'...
Chipmakers including Micron Technology and SK Hynix have introduced the availability of their 176-layer 3D NAND flash chips, and are expected to ramp up the chip output for UFS and...
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Following spending of US$106.1 billion in 2018 and US$102.5 billion in 2019, worldwide semiconductor capex is expected to grow 6% to US$108.1 billion this year, according to IC Ins...
SK Hynix has developed what the company claims is the industry's most multilayered 176-layer 512Gb triple-level cell (TLC) 4D NAND flash, and started delivering the chip samples to...
