Taiwan-based Integrated Service Technology (iST), Sporton International and Materials Analysis Technology (MA-tek), all dedicated to semiconductor materials analysis, IC test and...
Taiwan-based IC test solutions providers including Chunghwa Precision Test Tech (CHPT), Keystone Microtech and WinWay Technology are poised to embrace robust orders from major chipmakers...
MediaTek is expected to embrace an ambitious strategy to grow its presence in the 5G smartphone SoC sector. It will focus its efforts on 5G chip solutions for the upper midrange smartphone...
MediaTek reportedly plans to unveil its second 5G SoC in the latter half of December, one month after it released the first model of its 5G SoC family product, the Dimensity 1000,...
Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...
Smart glasses enabled by AR/MR technologies may gradually replace smartphones, with such a trend beginning to emerge in 2023 according to Tom Liang, chairman for both Taiwan-based...
MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.
TSMC uses its N7, the foundry's 7nm process without EUV, to fabricate Qualcomm's latest flagship processor, Snapdragon 865 series. Nevertheless, its Snapdragon 765 chips are being...
The main battlefield in the 5G mobile chip market is expected to shift from flagship models to mostly midrange ones in the first half of 2020, as around 70% of over 200 million 5G...
Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are...
5G mobile SoC unit price will stay above US$100 in the first half of 2020, several times that for 4G solutions, as tight capacity at TSMC's 7nm node is likely to keep production cost...
Demand for anylayer HDI boards from Chinese handset vendors has been increasing sharply as such boards are badly needed for carrying 7nm APs, now mainstream core SoCs for their smartphones,...
Global demand for 5G CPE (customer premise equipment) is expected to grow rapidly to 120 million units in 2025 from 100,000 units in 2019, prompting chipmakers such as Qualcomm and...