中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Computex 2025
Meet the Analysts
Server EMS Tracker
On-Demand Briefing
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
US May Tighten Grip on EDA Access — What It Could Mean for China’s Chip Future
Tomorrow's Headlines
4h 46min ago
A familiar beginning? Xiaomi takes a page from Apple’s chip playbook
Tomorrow's Headlines
4h 46min ago
Who drained Wolfspeed’s plate?
Tomorrow's Headlines
4h 46min ago
When zero mileage doesn’t mean new: Cracks widen in China’s auto mirage
Tomorrow's Headlines
4h 46min ago
Mitac rewires its global playbook under tariff pressure
Tomorrow's Headlines
4h 46min ago
Why Samsung is quietly repurposing its old memory fabs
Tomorrow's Headlines
4h 47min ago
NEWS TAGGED TAIWAN CHINSAN
Tuesday 1 September 2009
Capacitor maker Chinsan sees 1H09 profit
Aluminum electrolytic capacitor maker Taiwan Chinsan Electronic Industrial has reported net profit of NT$212 million (US$6.45 million) for the first half of 2009 with a net EPS of...
4/4
pages
1
2
3
4
BIZ FOCUS
May 29, 14:53
Pegatron debuted independently at Computex 2025,
showcasing AI and smart manufacturing capabilities to establish itself as a leading design and manufacturing services brand
Thursday 29 May 2025
Pegatron unveiled Verge: Cutting-edge AI hardware-ready AR smart glasses reference design at COMPUTEX 2025
Thursday 29 May 2025
PEGATRON unveils groundbreaking AI and digital transformation initiatives at GTC Taipei 2025
Thursday 29 May 2025
DATOTEK showcases AI-era memory & storage at COMPUTEX 2025, featuring immersive design and Switch 2-ready innovations
MOST-READ
7 DAYS NEWS
TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Lip-Bu Tan's Intel: leaner, flatter, and betting big on packaging
Intel CEO's four turnaround strategies unveiled
Huawei reportedly erects three advanced chip fabs in Shenzhen to sidestep foreign tech
D-Link sidesteps China rivalry with a Taiwan-first supply chain
MediaTek eyes $40B cloud ASIC bonanza as next growth engine
Samsung activates crisis planning, lines up US$7.27 billion in bank credit
Foxconn's Young Liu wants to export more than iPhones
ZT slips away, tariffs shift — Compal turns to Nvidia
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first