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Friday 11 July 2025
Largan faces challenges in tech development with exchange losses hurting 2Q25 profits
Largan Precision outlined technical hurdles for its advanced camera lens technology while acknowledging significant exchange losses that slashed second-quarter profit by 84%.
Friday 11 July 2025
SK Hynix narrows gap with Samsung as AI boom fuels HBM chip sales in Q2
SK Hynix is rapidly closing the gap with Samsung Electronics in the global memory chip race, driven by surging demand for high-bandwidth memory (HBM) used in AI applications. According...
Thursday 10 July 2025
Jim Keller to headline RISC-V Summit in Shanghai, highlighting China's open-source chip ambitions
Jim Keller, acclaimed semiconductor architect and Tenstorrent CEO, will deliver his first keynote at the fifth RISC-V Summit China from July 16 to 19 in Shanghai. His speech, "Open...
Thursday 10 July 2025
Jim Keller: US restrictions only accelerate China's chip development
As the global semiconductor competition intensifies, Silicon Valley chip guru and Tenstorrent CEO Jim Keller has shared exclusive insights on China's chip market, export restrictions,...
Thursday 10 July 2025
Ford reboots US battery plant after tax shift clears CATL licensing path
Ford will move forward with its US$3 billion lithium iron phosphate (LFP) battery plant in Marshall, Michigan, after the Trump administration's US$3.4 trillion budget bill preserved...
Thursday 10 July 2025
Semes' semiconductor cleaning process designated as South Korea's National Core Technology
Semes, the semiconductor equipment subsidiary of Samsung Electronics, has had its semiconductor cleaning process technology recognized by the South Korean government as a National...
Thursday 10 July 2025
Tripolar shift: Taiwan's battery swapping market moves toward fragmentation
Taiwan's electric scooter industry may be on the cusp of a new chapter—one defined not just by innovation, but by fragmentation. With the potential emergence of a third battery-swapping...
Thursday 10 July 2025
TSMC's CoPoS spurs industry shift as AI chip packaging hits glass ceiling
The global supply of CoWoS, or Chip-on-Wafer-on-Substrate, is tightening as demand for high-performance computing chips in AI applications continues to surge. These chips are simultaneously...
Thursday 10 July 2025
US tariff plans threaten Taiwan's key tech exports amid shifting trade dynamics
The US's latest tariff actions have sparked concern in Taiwan, raising fears that its export-driven tech sector could soon face steep import duties. Although Taiwan was not named...
Thursday 10 July 2025
Samsung bets on AI and foldables with Galaxy Z Fold7 launch
Samsung Electronics Co. introduced its newest flagship foldable smartphones under the Galaxy Z series on July 9, alongside updated wearable technology, including the Galaxy Watch...
Thursday 10 July 2025
South Korea's ESOL secures funding to challenge EUV supply chain dominance and boost domestic production
South Korean semiconductor extreme ultraviolet (EUV) equipment company ESOL recently announced the successful completion of a KRW74 billion (US$54.1 million) Series B financing round...
Wednesday 9 July 2025
South Korea's Hana cracks TGV glass substrate market with eye on AI chip boom
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
Wednesday 9 July 2025
AI apprentice available online; Profet AI facilitates manufacturing transformation and resolves industry challenges
The emergence of AI has initiated a new era of intelligent revolution in smart manufacturing. In this context, Jerry Huang, founder and CEO of Profet AI, highlighted that the global...
Wednesday 9 July 2025
TRI unveils new multi-camera AOI, TR7500 SIII Ultra
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra. The new Multi...
Wednesday 9 July 2025
Intel halts in-house glass substrate development as Tan avoids 'R&D trap'
Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...