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Thursday 29 August 2024
Morglory launches new single-crystal diamond disks

Global leading single-crystal diamond technology enters the CMP process application market

Thursday 29 August 2024
AI surge ignites MLCC demand: passive component industry poised for growth
As AI technology continues to permeate various industries, the demand for AI servers is seeing steady growth. With Nvidia's Blackwell GB200 set to begin mass production, a surge in...
Thursday 29 August 2024
TPSC new plants begin delivery of perovskite solar cells
Taiwan Perovskite Solar Corp. (TPSC) has invested more than NT$200 million (US$6.3 million) to build Taiwan's first carbon-free perovskite plant, which has delivered the first batch...
Thursday 29 August 2024
Enhanced semiconductor manufacturing capabilities showcased at SEMICON Taiwan 2024
In a significant leap forward for semiconductor manufacturing, ifm, a global leader in sensor technology, exhibited a comprehensive suite of smart sensing solutions at SEMICON Taiwan...
Thursday 29 August 2024
Panel-level packaging looks promising
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
Thursday 29 August 2024
Taiwan-based equipment makers eye biz opportunities from glass substrate packaging
Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging.
Thursday 29 August 2024
SK Hynix develops industry's first 1c DDR5
SK Hynix announced today that it has developed the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.
Wednesday 28 August 2024
Chinese OSAT eyes advanced packaging opportunities
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Wednesday 28 August 2024
Samsung maintains gaming monitor market edge with innovative glasses-free 2D/3D monitor
Samsung Electronics attended Gamescom 2024, held in Cologne, Germany. With an alleged largest-ever exhibition hall of about 800 square meters, Samsung unveiled its new gaming monitor,...
Tuesday 27 August 2024
Manz AG anticipates growth in advanced packaging amid CoWoS shortage
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
Tuesday 27 August 2024
China-based OSAT major delivers strong performance in 1H24
JCET, a leading Chinese semiconductor packaging and testing services provider, has announced impressive financial performance for the first half of 2024. The company reported a significant...
Monday 26 August 2024
Automotive component suppliers thrive despite market downturn
Despite a recent downturn in the overall automotive market, suppliers of automotive components have reported a rise in revenue. This trend is particularly pronounced in the automotive...
Monday 26 August 2024
SDC hints at launching 'competitively priced' micro OLED
Samsung Display (SDC) president Joo-sun Choi expressed strong confidence in the commercialization of Micro OLED.
Monday 26 August 2024
What are pet stores using this industrial AI vision platform for?
Solomon Technology, a leader in AI and robotics solutions, has developed a powerful...
Friday 23 August 2024
Mitsubishi Materials develops world's largest rectangular silicon substrate for AI chips
Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research