AUO will participate in SID (Display Week) 2024 to showcase Micro LED and highlight their investment in three major display technologies for green tech applications, particularly...
Asia Optical, one of Taiwan's leading optical device suppliers, has achieved several breakthroughs in recent months, as stated by chairman Lai Yi-Jen during the company's earnings...
US chipmaker Nvidia Corp. is investing in Wayve Technologies Ltd., joining a US$1.05 billion funding round for the UK startup that wants to get its autonomous-driving technology into...
Mechatronic Systemtechnik GmbH (Mechatronic), a leading global supplier of automation equipment for critical wafer handling, proudly announces the opening of its new cutting-edge...
UnaBiz, a Massive Internet of Things (IoT) service provider and integrator, announces performance evolution on Sigfox 0G technology, reducing device energy consumption by up to 18...
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
EISO, the PCB factory, participated in the Satellite 2024 Conference & Exhibition held in Washington DC, USA for the first time, marking the company's entry into Low-Earth Orbit...
On May 2, Powerchip Semiconductor Manufacturing Corporation (PSMC) held the grand opening ceremony for its new Tongluo Fab at the Miaoli Tongluo Science Park.
Equipment makers have seen the visibility of TSMC's order extended to 2025, and Intel and OSATs have also placed orders, according to industry sources in Taiwan.
The Taiwan Semiconductor Manufacturing Company, also known as Taiwan's "Silicon Shield," does not fully guarantee preventing war for Taiwan, says DIGITIMES Research analyst Eric Ch...
The US Department of Commerce and Micron Technology have signed a non-binding Preliminary Memorandum of Terms (PMT) to provide up to US$6.14 billion in direct funding under the CHIPS...
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
